公开(公告)号：US20240343558A1

公开(公告)日：2024-10-17

申请号：US18632684

申请日：2024-04-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Petteri KILPINEN ,  Marko PEUSSA ,  Antti IIHOLA ,  Altti TORKKELI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81B3/001 ,  B81C1/00666 ,  B81C1/00968 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/096 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  B81C2203/036

Abstract: A device is provided that includes a handle layer with at least one cavity and suspension structure, a patterned polycrystalline silicon (poly-Si) first device layer, where at least one structural element is suspended by the structure, and may include a seismic element. A second electrically insulating layer is present, followed by a second device layer of patterned single-crystal silicon (mono-Si) with at least one moveably suspended seismic element above the first layer. A cap layer finalizes the structure, with the handle layer, device layers, and the cap layer forming an enclosure's walls. The first and second insulating layers bond the handle and device layers. The enclosure includes at least one seismic element from the second device layer, and at least one static and moveable electrode for motion detection or causation, with the static electrode in the first device layer.

公开(公告)号：US20210188621A1

公开(公告)日：2021-06-24

申请号：US17124988

申请日：2020-12-17

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Marko PEUSSA ,  Pasi KIVINEN

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125

Abstract: This disclosure describes a microelectromechanical device comprising at least one mobile rotor. The rotor comprises a rotor measurement region and a rotor stopper region and a rotor isolation region which connects the rotor measurement region mechanically to the rotor stopper region and isolates the rotor measurement region electrically from the rotor stopper region.

公开(公告)号：US20210122628A1

公开(公告)日：2021-04-29

申请号：US17081416

申请日：2020-10-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Marko PEUSSA

IPC: B81C1/00 ,  B81B3/00

Abstract: A microelectromechanical device comprising a mobile rotor in a silicon wafer. The rotor comprises one or more high-density regions. The one or more high-density regions in the rotor comprise at least one high-density material which has a higher density than silicon. The one or more high-density regions have been formed in the silicon wafer by filling one or more fill trenches in the rotor with the at least one high-density material. The one or more fill trenches have a depth/width aspect ratio of at least 10, and the one or more fill trenches have been filled by depositing the high-density material into the fill trenches in an atomic layer deposition (ALD) process.