MULTILAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20200006002A1

    公开(公告)日:2020-01-02

    申请号:US16443933

    申请日:2019-06-18

    Abstract: A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20200006004A1

    公开(公告)日:2020-01-02

    申请号:US16439815

    申请日:2019-06-13

    Abstract: A multilayer ceramic electronic component includes an electronic component main body including a first outer electrode disposed on a first side surface of a multilayer body, and a second outer electrode spaced apart from the first outer electrode and disposed on the first side surface, a first metal terminal connected to the first outer electrode, a second metal terminal connected to the second outer electrode, and an exterior material. The first side surface or a second side surface opposes a mounting surface of a mounting substrate, first and second inner electrode layers are disposed perpendicularly or substantially perpendicularly to the mounting surface, and a portion of the first side surface, the first and second outer electrodes, and a portion of the first and second metal terminals are covered with the exterior material.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    3.
    发明申请

    公开(公告)号:US20180350524A1

    公开(公告)日:2018-12-06

    申请号:US15986925

    申请日:2018-05-23

    Abstract: A multilayer ceramic electronic component includes first and second electronic component bodies and first and second metal terminals. The first and second electronic component bodies are vertically stacked with a gap therebetween. The first metal terminal includes terminal joining portions, a first inter-component extending portion, a first extending portion, and a first mounting portion. The second metal terminal includes terminal joining portions, a second inter-component extending portion, a second extending portion, and a second mounting portion. The first and second inter-component extending portions are disposed in the gap between the first electronic component body and the second electronic component body.

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