公开(公告)号：US20220208626A1

公开(公告)日：2022-06-30

申请号：US17655180

申请日：2022-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56 ,  H01L25/16

Abstract: A module includes a substrate, a first component, and a first sealing resin layer. The substrate includes a first principal surface. The first component is mounted on the first principal surface. The first sealing resin layer contains a filler containing an inorganic oxide as a main component. The first sealing resin layer is provided on the first principal surface. The first sealing resin layer seals the first component. A marking portion is provided on a surface of the first sealing resin layer on a side opposite to the substrate. In the first sealing resin layer, the content rate of the filler is smaller in a second portion on the side opposite to the substrate than in a first portion on the substrate.

公开(公告)号：US20220122925A1

公开(公告)日：2022-04-21

申请号：US17646155

申请日：2021-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA

IPC: H01L23/552 ,  H01F41/00 ,  H01L25/16 ,  H01F27/36

Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.

公开(公告)号：US20230217599A1

公开(公告)日：2023-07-06

申请号：US18184728

申请日：2023-03-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA

IPC: H05K3/30 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K3/305 ,  H05K3/0052 ,  H05K1/181 ,  H05K2201/10007 ,  H05K2201/10977 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K3/3478

Abstract: An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.

公开(公告)号：US20230163086A1

公开(公告)日：2023-05-25

申请号：US18056307

申请日：2022-11-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Minoru KOMIYAMA ,  Tadashi NOMURA ,  Yoshihito OTSUBO ,  Toru KOMATSU

IPC: H01L23/66 ,  H01L23/498 ,  H05K9/00 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L23/49811 ,  H05K9/0049 ,  H01L23/31 ,  H05K9/0084

Abstract: A module comprises: a substrate having a first surface; a first component and a second component mounted on the first surface; a conductive member mounted therebetween; and a resin seal disposed to cover the first surface, the first component and the second component and also seal a portion of the conductive member. The resin seal has a recess that exposes at least a portion of the conductive member, and inside the recess the resin seal and the conductive member have a side surface and a surface, respectively, covered with a first shield film. The first shield film inside the recess is covered with a second shield film smaller in thickness than the first shield film. The resin seal has a surface facing away from the first surface and covered with the second shield film.

公开(公告)号：US20220216164A1

公开(公告)日：2022-07-07

申请号：US17656008

申请日：2022-03-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA ,  Yukiya YAMAGUCHI

IPC: H01L23/552 ,  H01L23/24 ,  H01L21/56

Abstract: A module includes a substrate including a first surface, a first component mounted on first surface, and a first sealing resin sealing first component. First sealing resin contains a filler. An upper surface of first sealing resin includes a first region and a second region. A ratio of an area where the filler is exposed from first sealing resin in the second region is smaller than a ratio of an area where the filler is exposed from first sealing resin in the first region, at least the first region and side surfaces of the first sealing resin are covered with a shield film, and the second region is not covered with shield film.

公开(公告)号：US20220352088A1

公开(公告)日：2022-11-03

申请号：US17811113

申请日：2022-07-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Yukiya YAMAGUCHI ,  Hiroshi NISHIKAWA ,  Toru KOMATSU

IPC: H01L23/552 ,  H01L25/16

Abstract: A module includes a substrate including a first surface, at least one first component mounted on the first surface, a shield member mounted on the first surface to cover the first component, and a first sealing resin arranged at least between the shield member and the first surface. The shield member includes a top surface portion in a form of a plate and a plurality of leg portions that extend from the top surface portion toward the first surface.

公开(公告)号：US20220264748A1

公开(公告)日：2022-08-18

申请号：US17662687

申请日：2022-05-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryohei OKABE ,  Toru KOMATSU

IPC: H05K3/28 ,  H05K9/00 ,  H01L23/28 ,  H05K1/18

Abstract: An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.

公开(公告)号：US20230246010A1

公开(公告)日：2023-08-03

申请号：US18297110

申请日：2023-04-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Tadashi NOMURA

IPC: H01L25/16 ,  H01L23/552

CPC classification number: H01L25/162 ,  H01L23/552

Abstract: An electronic component module includes a substrate, a sub-module to be mounted on a main surface of the substrate, and a terminal conductor formed on a main surface of the substrate. The sub-module includes a substrate, an electronic component, an electronic component, and an electronic component. The substrate has a main surface and a main surface. The electronic component and the electronic component are mounted on the main surface. The electronic component is mounted on the main surface. The substrate has a through hole that penetrates between the main surface and the main surface. The sub-module is mounted so that the electronic component may be housed in the through hole.

公开(公告)号：US20230223355A1

公开(公告)日：2023-07-13

申请号：US18184734

申请日：2023-03-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Toru KOMATSU

IPC: H01L23/552 ,  H01L25/16 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L25/16 ,  H01L23/13

Abstract: An electronic component module includes a plurality of components including a terminal and placed along a plane, a frame substrate supporting at least some components among the plurality of components, a sealing resin portion sealing the plurality of components and the frame substrate, and a shield layer covering an outer surface of the sealing resin portion. The frame substrate includes an insulating layer, a ground layer, and a ground bump electrically connected to the ground layer, and also an opening supporting a portion other than solder bumps of bump components, and the ground layer of the frame substrate is exposed to a side surface of the frame substrate and is electrically connected to the shield layer. The terminal of the plurality of components and the ground bump are exposed while protruding from a plane of the sealing resin portion and are used as mounting terminals of the electronic component module.

公开(公告)号：US20210043583A1

公开(公告)日：2021-02-11

申请号：US17083506

申请日：2020-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Toru KOMATSU

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/66 ,  H01L23/31

Abstract: A high frequency module having a groove for shielding formed in a sealing resin layer achieves downsizing without damaging wiring electrodes formed on a wiring board or mounting components. A manufacturing method of a high frequency module includes mounting components on an upper surface of a wiring board, and then forming a sacrificial layer for forming a groove. The method further includes forming a sealing resin layer for sealing the components and the sacrificial layer, and dissolving and removing the sacrificial layer to form the groove for shielding. Finally, the method includes forming a shield film coating the surface of the sealing resin layer, and the high frequency module is manufactured. With this method, even when the groove is formed at a position overlapping with the component or a surface layer wiring electrode, the high frequency module can be downsized without damaging the component or the surface layer wiring electrode.