公开(公告)号：US20150042417A1

公开(公告)日：2015-02-12

申请号：US14445431

申请日：2014-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syuichi ONODERA ,  Syuji YAMATO ,  Tadaji TAKEMURA

IPC: H03H9/54 ,  H03H9/64 ,  H03H9/25 ,  H03H9/00 ,  H03H9/205

CPC classification number: H03H9/6433 ,  H03H9/0009 ,  H03H9/0057 ,  H03H9/605 ,  H03H9/6479 ,  H03H9/6483 ,  H03H9/725

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract translation: 高频模块包括多层基板，滤波器基板，覆盖层，连接电极和电感器。 过滤器基板包括第一主表面，其上布置有包括在过滤器单元中的IDT电极，并且第一主表面面对多层基板的安装表面。 覆盖层与过滤器基底的第一主表面间隔开并与其相对。 连接电极连接多层基板和过滤基板。 电感器之一连接在滤波器单元和第一外部连接端子之间。 电感器中的另一个连接在过滤器单元和地面之间。 电感器设置在多层基板内。 电感器彼此感应耦合。

公开(公告)号：US20130335171A1

公开(公告)日：2013-12-19

申请号：US14014839

申请日：2013-08-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syuji YAMATO ,  Mitsuyoshi HIRA

IPC: H03H9/64

CPC classification number: H03H9/64 ,  H01L2224/11 ,  H03H9/059 ,  H03H9/1085 ,  H03H9/1092 ,  H03H9/6483

Abstract: An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.

Abstract translation: 电子部件包括当从z轴方向俯视时围绕压电基板的主表面上的元件区域的支撑层。 表面声波元件设置在元件区域中。 覆盖层设置在支撑层上并且与主表面相对。 支柱构件将主表面和覆盖层连接在由主表面，支撑层和覆盖层包围的空间中，并且不与支撑层接触。

公开(公告)号：US20140184019A1

公开(公告)日：2014-07-03

申请号：US14176392

申请日：2014-02-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syuji YAMATO

IPC: H01L41/053

CPC classification number: H01L41/053 ,  H03H9/0576 ,  H03H9/725 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10083

Abstract: A circuit module and a composite circuit module, which suppress or prevent damage to a connection to or within a device when heat is applied, includes a SAW filter including a piezoelectric substrate. In a package substrate that is a resin substrate, the SAW filter is mounted. A mounting substrate is a multilayer substrate mounted on a mother substrate, and the package substrate is mounted therein.

Abstract translation: 在施加热量时抑制或防止对器件的连接的损坏的电路模块和复合电路模块包括具有压电基板的SAW滤波器。 在作为树脂基板的封装基板中，安装SAW滤波器。 安装基板是安装在母基板上的多层基板，其中安装有封装基板。

公开(公告)号：US20130307637A1

公开(公告)日：2013-11-21

申请号：US13947339

申请日：2013-07-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadaji TAKEMURA ,  Syuji YAMATO ,  Takanori UEJIMA ,  Morio TAKEUCHI

IPC: H03H9/72

CPC classification number: H03H9/6406 ,  H01P1/213 ,  H03H9/0576 ,  H03H9/6436 ,  H03H9/725 ,  H04B1/52 ,  H04B1/525

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract translation: 在改善高频侧信号路径和低频侧信号路径的隔离特性的基板中，双工器和基板模块，封装基板包括安装在其上的两个SAW滤波器，并且限定双工器的一部分 。 基板主体包括彼此相对的主表面。 在一个主表面上设置接地电极，并用于连接两个SAW滤波器中的任一个。 接地电极设置在主表面之一上，并用于连接安装双工器的安装基板，并且在从z轴方向俯视时分别与接地电极重叠。 当从z轴方向平面地观察时，彼此叠置的焊盘电极和焊盘电极彼此电连接。

公开(公告)号：US20150084712A1

公开(公告)日：2015-03-26

申请号：US14560148

申请日：2014-12-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syuji YAMATO

IPC: H03H9/72 ,  H03H9/00

CPC classification number: H03H9/725 ,  H03H9/0028 ,  H03H9/0085 ,  H03H9/0576 ,  H03H9/6459

Abstract: A first filter channel with superior attenuation characteristics for transmission signals and is less susceptible to influence of transmission signals inputted to a transmission SAW filter device, is disposed closer to a transmission terminal, whereas a second filter channel with poor attenuation characteristics in a transmission band and is more susceptible to the influence of transmission signals inputted to the transmission SAW filter device, is disposed farther from a transmission terminal to improve isolation characteristics in a differential mode of a duplexer.

Abstract translation: 对于传输信号具有优异的衰减特性并且较不易受输入到传输SAW滤波器器件的传输信号的影响的第一滤波器通道设置得更靠近传输端，而在传输频带中具有差的衰减特性的第二滤波器通道和 更容易受输入到发送SAW滤波器装置的传输信号的影响，远离传输终端设置，以提高双工器的差分模式下的隔离特性。