公开(公告)号：US20140131853A1

公开(公告)日：2014-05-15

申请号：US14157782

申请日：2014-01-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadaji TAKEMURA

IPC: H01L23/00 ,  H01L21/78 ,  H01L29/41 ,  H01L27/04

CPC classification number: H01L24/81 ,  H01L21/78 ,  H01L27/04 ,  H01L29/41 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  H03H9/0542 ,  H03H9/059 ,  H03H9/1085 ,  H01L2924/00

Abstract: A method of manufacturing a composite module prevents a connection electrode electrically coupled to a functional element from separating from a first principal surface of an element substrate. A transmission filter element, a reception filter element, connection electrodes electrically coupled to the transmission filter element and the reception filter element, and an insulating layer surrounding the transmission filter element, the reception filter element, and the connection electrodes are disposed on a first principal surface of an element substrate. The insulating layer covers at least a portion of the surface of each of the connection electrodes. Because the portion of the surface of each of the connection electrodes in an exposed state is covered with the insulating layer, the connection electrodes electrically coupled to the transmission filter element and the reception filter element are prevented from separating from the first principal surface of the element substrate.

Abstract translation: 复合模块的制造方法防止与功能元件电耦合的连接电极与元件基板的第一主表面分离。 发送滤波器元件，接收滤波器元件，电耦合到发送滤波器元件和接收滤波器元件的连接电极以及围绕发送滤波器元件，接收滤波器元件和连接电极的绝缘层设置在第一主体 元件基板的表面。 绝缘层覆盖每个连接电极的表面的至少一部分。 由于暴露状态的每个连接电极的表面的部分被绝缘层覆盖，所以阻止电耦合到透射滤光元件和接收滤光元件的连接电极与元件的第一主表面分离 基质。

公开(公告)号：US20130307637A1

公开(公告)日：2013-11-21

申请号：US13947339

申请日：2013-07-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadaji TAKEMURA ,  Syuji YAMATO ,  Takanori UEJIMA ,  Morio TAKEUCHI

IPC: H03H9/72

CPC classification number: H03H9/6406 ,  H01P1/213 ,  H03H9/0576 ,  H03H9/6436 ,  H03H9/725 ,  H04B1/52 ,  H04B1/525

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract translation: 在改善高频侧信号路径和低频侧信号路径的隔离特性的基板中，双工器和基板模块，封装基板包括安装在其上的两个SAW滤波器，并且限定双工器的一部分 。 基板主体包括彼此相对的主表面。 在一个主表面上设置接地电极，并用于连接两个SAW滤波器中的任一个。 接地电极设置在主表面之一上，并用于连接安装双工器的安装基板，并且在从z轴方向俯视时分别与接地电极重叠。 当从z轴方向平面地观察时，彼此叠置的焊盘电极和焊盘电极彼此电连接。

公开(公告)号：US20170146570A1

公开(公告)日：2017-05-25

申请号：US15423755

申请日：2017-02-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadaji TAKEMURA

IPC: G01R1/36 ,  H05K1/03 ,  G01R31/26 ,  H05K1/18 ,  G01R1/073 ,  G01R1/20 ,  H05K1/14 ,  H05K1/09

CPC classification number: G01R1/36 ,  G01R1/07342 ,  G01R1/20 ,  G01R31/2601 ,  G01R31/2886 ,  H05K1/0263 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/092 ,  H05K1/144 ,  H05K1/181 ,  H05K3/4629 ,  H05K3/4694 ,  H05K2201/0175 ,  H05K2201/10181 ,  H05K2203/061

Abstract: A probe card for use in electrical testing of a device under test includes a mother substrate, a multilayer circuit board mounted on one main surface of the mother substrate, an outer electrode on the mother substrate, a coupling electrode on the main surface of the multilayer circuit board opposite the mother substrate to which a probe pin for supplying power to the device under test is connected, a power line PL coupling the outer electrode and the coupling electrode together, and a blowout portion including fuse wiring, the fuse wiring inserted in the power line PL and having a smaller current capacity than the power line PL. The power line PL has an exposed portion that is exposed on the surface of the multilayer circuit board, and the blowout portion is in the exposed portion of the power line PL.

公开(公告)号：US20150042417A1

公开(公告)日：2015-02-12

申请号：US14445431

申请日：2014-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syuichi ONODERA ,  Syuji YAMATO ,  Tadaji TAKEMURA

IPC: H03H9/54 ,  H03H9/64 ,  H03H9/25 ,  H03H9/00 ,  H03H9/205

CPC classification number: H03H9/6433 ,  H03H9/0009 ,  H03H9/0057 ,  H03H9/605 ,  H03H9/6479 ,  H03H9/6483 ,  H03H9/725

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract translation: 高频模块包括多层基板，滤波器基板，覆盖层，连接电极和电感器。 过滤器基板包括第一主表面，其上布置有包括在过滤器单元中的IDT电极，并且第一主表面面对多层基板的安装表面。 覆盖层与过滤器基底的第一主表面间隔开并与其相对。 连接电极连接多层基板和过滤基板。 电感器之一连接在滤波器单元和第一外部连接端子之间。 电感器中的另一个连接在过滤器单元和地面之间。 电感器设置在多层基板内。 电感器彼此感应耦合。

公开(公告)号：US20140333175A1

公开(公告)日：2014-11-13

申请号：US14445474

申请日：2014-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadaji TAKEMURA

IPC: H01L41/053

CPC classification number: H01L41/0533 ,  B81B7/0051 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3677 ,  H01L2924/0002 ,  H03H9/1071 ,  H01L2924/00

Abstract: An electronic component element includes a piezoelectric substrate and a comb-shaped electrode located on one principal surface of the piezoelectric substrate. A support layer is arranged around the comb-shaped electrode. A cover layer is disposed so as to cover the support layer and the comb-shaped electrode. Via-hole electrodes extend through the cover layer and are connected to the comb-shaped electrode. An uneven portion is located on a principal surface of the cover layer that is opposite to a principal surface of the cover layer that is opposed to the comb-shaped electrode.

Abstract translation: 电子元件包括压电基板和位于压电基板的一个主表面上的梳状电极。 支撑层布置在梳状电极周围。 覆盖层设置成覆盖支撑层和梳状电极。 通孔电极延伸穿过覆盖层并连接到梳状电极。 覆盖层的与梳状电极相对的覆盖层的主面相反的主面上设有凹凸部。

公开(公告)号：US20140320234A1

公开(公告)日：2014-10-30

申请号：US14325468

申请日：2014-07-08

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Tadaji TAKEMURA

IPC: H03H9/72 ,  H03H9/64

CPC classification number: H03H9/64 ,  H03H9/02622 ,  H03H9/02866 ,  H03H9/1071 ,  H03H9/1092

Abstract: A surface acoustic wave device includes a piezoelectric substrate including an interdigital transducer located on one principal surface thereof, an insulating layer arranged around the interdigital transducer, a cover layer arranged over the insulating layer and the interdigital transducer, and a columnar electrode penetrating through the insulating layer and the cover layer, and connected to the interdigital transducer through a connection wiring, wherein a buffer layer is arranged on the other principal surface of the piezoelectric substrate.

Abstract translation: 表面声波装置包括：压电基板，包括位于其一个主表面上的叉指式换能器，布置在叉指式换能器周围的绝缘层，布置在绝缘层和交叉指型换能器上的覆盖层，以及贯穿绝缘体的柱状电极 层和覆盖层，并且通过连接布线连接到叉指式换能器，其中缓冲层布置在压电基板的另一主表面上。

公开(公告)号：US20140118084A1

公开(公告)日：2014-05-01

申请号：US14146740

申请日：2014-01-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadaji TAKEMURA

IPC: H03H9/70 ,  H03H9/72

CPC classification number: H03H9/706 ,  H03H9/0576 ,  H03H9/1092 ,  H03H9/725

Abstract: A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

Abstract translation: 电路模块包括安装在模块板上的双工器，并且覆盖层堆叠在设置在器件板的一个主表面上以封闭其预定区域的绝缘层上。 在设备基板和覆盖层之间的绝缘层包围的空间内，在其预定区域中的设备基板的一个主表面上设置具有不同传输带的传输滤波器件和接收滤波器装置。 因此，如现有技术那样，双工器不包括封装板，并且依次包括安装在模块板上的双工器的电路模块的高度和尺寸显着降低。