公开(公告)号：US09978515B2

公开(公告)日：2018-05-22

申请号：US14568446

申请日：2014-12-12

申请人： Murata Manufacturing Co., Ltd.

发明人： Kazuto Ogawa ,  Isao Kato

IPC分类号： H05K7/00 ,  H05K1/16 ,  H01G2/06 ,  H05K1/11 ,  H01G4/12 ,  H01G4/30 ,  H05K1/18 ,  H05K3/30 ,  H05K3/00

CPC分类号： H01G2/065 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/4913

摘要： An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.

公开(公告)号：US09839135B2

公开(公告)日：2017-12-05

申请号：US14332652

申请日：2014-07-16

申请人： Murata Manufacturing Co., Ltd.

发明人： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa ,  Mitsuhide Kato

IPC分类号： H05K3/00 ,  H01G2/06 ,  H05K1/14 ,  H05K3/34

CPC分类号： H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

摘要： A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

公开(公告)号：US09801283B2

公开(公告)日：2017-10-24

申请号：US14334688

申请日：2014-07-18

申请人： Murata Manufacturing Co., Ltd.

发明人： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa

IPC分类号： H05K3/00 ,  H05K1/14 ,  H05K3/34

CPC分类号： H05K3/0052 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

摘要： A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.