公开(公告)号：US09839135B2

公开(公告)日：2017-12-05

申请号：US14332652

申请日：2014-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa ,  Mitsuhide Kato

IPC: H05K3/00 ,  H01G2/06 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

公开(公告)号：US09801283B2

公开(公告)日：2017-10-24

申请号：US14334688

申请日：2014-07-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/0052 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

公开(公告)号：US09343844B2

公开(公告)日：2016-05-17

申请号：US13941762

申请日：2013-07-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihiro Aoyama ,  Junya Shimakawa

IPC: H05K1/11 ,  H05K3/34 ,  H01R13/56 ,  H01L23/498

CPC classification number: H01R13/56 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/112 ,  H05K3/3436 ,  H01L2924/00

Abstract: Based on a result of repeated analysis of stress caused by application of an external impact in a circuit board, which is rectangular or substantially rectangular in plan view and includes mounting electrodes, included in an electronic component, the mounting electrodes near four corners of the circuit board, of the mounting electrodes provided on a back surface of the circuit board included in the electronic component, are provided at positions shifted from diagonal lines of the back surface. Hence, the stress produced near the four corners of the circuit board is reduced, and this can effectively prevent a fracture, a chip, and a crack from being caused in the circuit board.

Abstract translation: 基于在平面图中矩形或大致矩形的电路板中施加外部冲击引起的应力的重复分析的结果，并且包括在电子部件中的安装电极，电路的四个角附近的安装电极 设置在电子部件中包括的电路板的背面上的安装电极的基板设置在从后表面的对角线偏移的位置处。 因此，电路板四角附近产生的应力减小，能够有效地防止在电路基板中产生断裂，芯片和裂纹。