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公开(公告)号：US20240072403A1
公开(公告)日：2024-02-29
申请号：US18492969
申请日：2023-10-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tatsunori KAN
IPC: H01P1/205
CPC classification number: H01P1/205
Abstract: A filter device includes a stack body, plate electrodes, resonators, and shield conductors. The plate electrodes are disposed inside the stack body apart from each other in the stacking direction. The resonators are disposed between the plate electrodes and extend in the Y-axis direction. The shield conductors are disposed on the side surfaces of the stack body, respectively. The shield conductors are connected to the plate electrodes. The resonators are disposed inside the stack body side by side in the X-axis direction. A first end of each of the resonators is connected to the shield conductor, and a second end thereof is separated from the shield conductor. The first end of each of the resonators is formed with a cutout.
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Patent Agency Ranking
2.发明申请公开(公告)号：US20170303398A1
公开(公告)日：2017-10-19
申请号：US15635786
申请日：2017-06-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tatsunori KAN
CPC classification number: H05K1/18 , H01L23/10 , H01L23/13 , H01L23/15 , H01L2224/16225 , H01L2924/0002 , H01L2924/16152 , H01L2924/16195 , H03H9/1014 , H03H9/1057 , H05K1/0306 , H05K3/1291 , H05K2201/10075 , H01L2924/00
Abstract: Close-contact layers that are capable of improving the degree of contact between electrodes and a ceramic insulating layer can be formed at low cost by firing a glass paste. When the electrodes, the ceramic insulating layer, and the close-contact layers are fired at the same time, the glass paste is sintered last, and thus, formation of voids, defects, and the like in portions of the ceramic insulating layer, on which the electrodes are disposed, as a result of shrinkage of the electrodes and the ceramic insulating layer at the time of firing being hindered by stress generated due to the difference in the degree of shrinkage can be suppressed. Therefore, the structure of the ceramic insulating layers in the above portions can be elaborated by the close-contact layers.
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公开(公告)号：US20170048982A1
公开(公告)日：2017-02-16
申请号：US15336941
申请日：2016-10-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shota ISHIHARA , Tetsuya ODA , Tatsunori KAN , Kenichi ATSUCHI
CPC classification number: H05K1/185 , H05K1/111 , H05K3/284 , H05K3/34 , H05K3/3442 , H05K2201/09663 , H05K2201/10431 , H05K2201/10507 , H05K2201/10522 , H05K2201/10636 , H05K2201/10977 , H05K2203/048 , H05K2203/1316 , Y02P70/611 , Y02P70/613
Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.
Abstract translation: 桥接部分12设置在安装部分11彼此相对的区域中，使得其朝向预定侧移位。 因此，即使桥接部12的线宽比现有技术中的线宽大，也可以在回流工序中适当地进行自对准现象。 因此，可以提供具有高树脂充电性能的树脂密封模块，并且包括电路基板，其中桥接部分12也不会破坏，即使根据较小尺寸的共同接地电极10的尺寸减小 电路部件5可靠地确保安装在电路基板上的多个电路部件5之间的充分的间隙。
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公开(公告)号：US20240040694A1
公开(公告)日：2024-02-01
申请号：US18485650
申请日：2023-10-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tomoki YAMAMOTO , Tatsunori KAN
CPC classification number: H05K1/0306 , H05K1/115 , C03C14/004 , C03C4/16 , H05K2201/0175 , H05K2201/0209 , C03C2214/04 , C03C2214/20 , C03C2204/00
Abstract: A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a second glass and a second ceramic filler. A sintering temperature of the second glass contained in the second dielectric layer is higher than a sintering temperature of the wiring conductor, and a grain size of the second glass contained in the second dielectric layer is smaller than a grain size of the first glass contained in the first dielectric layer.
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公开(公告)号：US20240021967A1
公开(公告)日：2024-01-18
申请号：US18475560
申请日：2023-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masashi ARAI , Tatsunori KAN
CPC classification number: H01P1/2002 , H01P3/16
Abstract: A filter device includes a laminated body, a plurality of resonator portions, and a plurality of capacitor portions facing the plurality of resonator portions in a Y-axis direction, respectively. Each of the resonator portions is formed by a plurality of resonant electrode elements. Each of the capacitor portions is formed by a plurality of capacitive electrode elements. The plurality of resonant electrode elements in the resonator portion are formed such that all of facing ends with respect to the capacitive electrode elements do not overlap with each other when viewed in a planar view from a Z-axis direction. The capacitive electrode elements in the capacitor portion are formed such that a gap between the capacitive electrode element and the resonant electrode element facing each other in a Y-axis direction is substantially constant in each layer in the Z-axis direction.
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公开(公告)号：US20240006733A1
公开(公告)日：2024-01-04
申请号：US18465262
申请日：2023-09-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tatsunori KAN
CPC classification number: H01P1/2002 , H01P3/16
Abstract: A filter device includes a laminated body, plate electrodes, shield terminals, a plurality of resonator portions, and a plurality of capacitor portions facing the plurality of resonator portions in a Y-axis direction, respectively. Each of the resonator portions is formed by a plurality of resonant electrode elements. Each of the capacitor portions is formed by a plurality of capacitive electrode elements. A part in each of the plurality of resonant electrode elements that faces the capacitive electrode elements extends in a direction along the Y-axis direction. The plurality of capacitive electrode elements extend in a direction that intersects with the Y-axis direction.
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