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    Multilayer ceramic capacitor
    2.
    发明授权
    Multilayer ceramic capacitor 有权

    公开(公告)号：US11335509B2

    公开(公告)日：2022-05-17

    申请号：US16788345

    申请日：2020-02-12

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takehisa Sasabayashi ,  Akitaka Doi ,  Kotaro Shimizu ,  Yoko Okabe

    IPC: H01G4/30 ,  H01G4/02 ,  H01G4/12 ,  H01G4/012

    Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 μm or more and about 1.5 μm or less, and having a maximum diameter of about 5.0 μm or less.

    Ceramic electronic component
    6.
    发明授权
    Ceramic electronic component 有权

    公开(公告)号：US09667174B2

    公开(公告)日：2017-05-30

    申请号：US14191480

    申请日：2014-02-27

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro Nishisaka ,  Satoshi Matsuno ,  Tetsuya Kisumi ,  Yoko Okabe

    IPC: H01L41/053 ,  H02N2/00 ,  H01F17/00 ,  H01L41/047 ,  H01C7/00

    CPC classification number: H02N2/00 ,  H01C7/008 ,  H01F17/0013 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/0533

    Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

    Ceramic electronic component and glass paste
    7.
    发明授权
    Ceramic electronic component and glass paste 有权
    陶瓷电子元件和玻璃糊

    公开(公告)号：US09328014B2

    公开(公告)日：2016-05-03

    申请号：US14191481

    申请日：2014-02-27

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro Nishisaka ,  Satoshi Matsuno ,  Tetsuya Kisumi ,  Yoko Okabe

    IPC: H01G4/30 ,  C03C8/18 ,  H01G4/228 ,  H01L41/047 ,  H01L41/053 ,  H01C7/00 ,  H01G4/232

    CPC classification number: C03C8/18 ,  H01C7/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0533

    Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.

    Abstract translation: 陶瓷电子部件包括陶瓷体，玻璃涂层和端子电极。 内部电极的端部在陶瓷体的表面露出。 玻璃涂层覆盖内部电极露出的陶瓷体的部分。 端子电极直接设置在玻璃涂层的上方，并且各自由镀膜构成。 玻璃涂层包括玻璃介质和分散在玻璃介质中的金属粉末颗粒，并且限定电连接内部电极和端子电极的导电路径。 金属粉末颗粒包括第一金属粉末颗粒和第二金属粉末颗粒。 第一金属粉末颗粒是平坦或基本平坦的粉末颗粒。 第二金属粉末颗粒是球形或基本上球形的粉末颗粒。

    CONDUCTIVE PASTE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    8.
    发明申请
    CONDUCTIVE PASTE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 有权
    导电胶片电子元件及制造电子元件的方法

    公开(公告)号：US20140347783A1

    公开(公告)日：2014-11-27

    申请号：US14457167

    申请日：2014-08-12

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Tetsuya Kisumi ,  Toshiki Nagamoto ,  Yasuhiro Nishisaka ,  Yoko Okabe

    IPC: H01G4/008 ,  H01G4/012 ,  H01B1/16 ,  H01G4/30

    CPC classification number: H01G4/30 ,  H01B1/16 ,  H01B1/22 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/129 ,  H01G4/232 ,  H01G4/2325

    Abstract: A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiO2 in the glass frit is 36 to 59 percent by mole, and a volume content of the glass frit is 6 to 11 percent by volume. In external electrodes of a multilayer ceramic capacitor using this conductive paste, the molar content of SiO2 in a glass phase is 38 to 60 percent by mole, and an occupation rate of the glass phase is 30% to 60% on the area ratio, and a maximum length c of the glass phase is 5 μm or less.

    Abstract translation: 导电糊包括金属粉末，含有Si成分的玻璃料和有机载体。 金属粉末具有平均形状，a / b的最大长度a与最大厚度b的比值为2.5以上，玻璃料中的SiO 2摩尔含量为36〜59摩尔％，体积含量 玻璃料为6〜11体积％。 在使用该导电性糊料的多层陶瓷电容器的外部电极中，玻璃相中的SiO 2的摩尔含量为38〜60摩尔％，玻璃相的占有率相对于面积比为30〜60％， 玻璃相的最大长度c为5μm以下。

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