Ceramic electronic component and wiring board having built-in ceramic electronic component
    4.
    发明授权
    Ceramic electronic component and wiring board having built-in ceramic electronic component 有权
    陶瓷电子部件和具有内置陶瓷电子部件的接线板

    公开(公告)号:US09148954B2

    公开(公告)日:2015-09-29

    申请号:US14223258

    申请日:2014-03-24

    Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

    Abstract translation: 陶瓷电子部件包括陶瓷体和外部电极。 陶瓷体包括第一和第二主表面,第一和第二侧表面以及第一和第二端面。 外电极设置在第一主表面上。 外电极包括含有Cu和玻璃的底层电极层和Cu镀层。 底层电极层设置在第一主表面上。 Cu镀层设置在下面的电极层上。 Cu镀层比下面的电极层厚。

    Multilayer ceramic capacitor
    5.
    发明授权

    公开(公告)号:US10186378B2

    公开(公告)日:2019-01-22

    申请号:US15835597

    申请日:2017-12-08

    Abstract: A multilayer ceramic capacitor includes a laminate of ceramic layers and internal electrodes, and a pair of external electrodes located on both end surfaces of the laminate and electrically connected to the internal electrodes. Each of the pair of external electrodes includes an underlying electrode layer on the surface of the laminate and including Cu, a bonding portion partially provided on a surface of the underlying electrode layer and including a Cu3Sn alloy, and a conductive resin layer provided on surfaces of the underlying electrode layer and the bonding portion, and a total area of the bonding portion is not less than about 2.7% and not more than about 40.6% of a total area of the underlying electrode layer.

    Ceramic electronic component
    6.
    发明授权

    公开(公告)号:US09667174B2

    公开(公告)日:2017-05-30

    申请号:US14191480

    申请日:2014-02-27

    Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

    Ceramic electronic component and glass paste
    7.
    发明授权
    Ceramic electronic component and glass paste 有权
    陶瓷电子元件和玻璃糊

    公开(公告)号:US09328014B2

    公开(公告)日:2016-05-03

    申请号:US14191481

    申请日:2014-02-27

    Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.

    Abstract translation: 陶瓷电子部件包括陶瓷体,玻璃涂层和端子电极。 内部电极的端部在陶瓷体的表面露出。 玻璃涂层覆盖内部电极露出的陶瓷体的部分。 端子电极直接设置在玻璃涂层的上方,并且各自由镀膜构成。 玻璃涂层包括玻璃介质和分散在玻璃介质中的金属粉末颗粒,并且限定电连接内部电极和端子电极的导电路径。 金属粉末颗粒包括第一金属粉末颗粒和第二金属粉末颗粒。 第一金属粉末颗粒是平坦或基本平坦的粉末颗粒。 第二金属粉末颗粒是球形或基本上球形的粉末颗粒。

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