公开(公告)号：US09548161B2

公开(公告)日：2017-01-17

申请号：US15073914

申请日：2016-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01G4/30 ,  H01G4/33 ,  H01L23/528 ,  H01L23/532 ,  H01L23/522 ,  H01L23/525 ,  H01L27/01

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有介电层的电容部分和形成在电介质层的相应上表面和下表面上的一对电极层。 此外，在电容部分上设置有保护层，一对互连层被拉出到保护层的上表面，并且形成外部电极以与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。

公开(公告)号：US20130194714A1

公开(公告)日：2013-08-01

申请号：US13795677

申请日：2013-03-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01G4/33

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer 22. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有电介质层的电容部分和形成在电介质层22的相应上表面和下表面上的一对电极层。此外，保护层设置在电容部分上，一对互连层 被拉出到保护层的上表面，并且外部电极形成为与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。

公开(公告)号：US09460859B2

公开(公告)日：2016-10-04

申请号：US13795677

申请日：2013-03-12

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01G4/30 ,  H01G4/33 ,  H01L23/522 ,  H01L23/525 ,  H01L27/01

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer 22. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有电介质层的电容部分和形成在电介质层22的相应上表面和下表面上的一对电极层。此外，保护层设置在电容部分上，一对互连层 被拉出到保护层的上表面，并且外部电极形成为与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。

公开(公告)号：US11830909B2

公开(公告)日：2023-11-28

申请号：US17651993

申请日：2022-02-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomoyuki Ashimine ,  Yuji Irie ,  Yasuhiro Murase

IPC: H01L29/92 ,  H01L21/265 ,  H01L29/06 ,  H01L29/66 ,  H01L29/94 ,  H01L23/31 ,  H02M7/5387

CPC classification number: H01L29/0607 ,  H01L29/66181 ,  H01L29/94 ,  H01L29/945 ,  H01L21/26533 ,  H01L23/3171 ,  H02M7/5387

Abstract: A semiconductor device is provided that includes a semiconductor substrate having a first main surface and a second main surface facing each other; a dielectric layer laminated on the first main surface of the semiconductor substrate; a first electrode layer laminated on the dielectric layer; and a protective layer covering at least an outer peripheral end of the dielectric layer and an outer peripheral end of the first electrode layer. Moreover, the protective layer is provided to expose an outer peripheral end on the first main surface of the semiconductor substrate. The semiconductor substrate includes a high-resistance region positioned at least directly under an outer peripheral end of the protective layer.

公开(公告)号：US20160204063A1

公开(公告)日：2016-07-14

申请号：US15073914

申请日：2016-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01L23/525 ,  H01L23/532 ,  H01L23/528

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有介电层的电容部分和形成在电介质层的相应上表面和下表面上的一对电极层。 此外，在电容部分上设置有保护层，一对互连层被拉出到保护层的上表面，并且形成外部电极以与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。