公开(公告)号：US09540275B2

公开(公告)日：2017-01-10

申请号：US15110575

申请日：2015-01-15

申请人： NAMICS CORPORATION

发明人： Raymond Dietz ,  Maciej Patelka ,  Cathy Shaw Trumble ,  Noriyuki Sakai ,  Hiroshi Yamaguchi

IPC分类号： C03C8/24 ,  H01L23/00 ,  C09J9/02 ,  C03C4/14 ,  C03C3/12 ,  H01B1/16

CPC分类号： C03C8/24 ,  C03C3/122 ,  C03C3/125 ,  C03C3/127 ,  C03C4/14 ,  C03C8/02 ,  C03C8/18 ,  C03C2204/00 ,  C03C2205/00 ,  C09J9/02 ,  H01B1/16 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/83851 ,  H01L2224/83948 ,  H01L2924/10272

摘要： A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360° C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) Ag2O, (B-2) V2O5, and (B-3) MoO3. The conductive paste can achieve binding at a relatively low temperature (such as 370° C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360° C.).

摘要翻译： 包含（A）导电颗粒的导电浆料，（B）基本上不含铅，砷，碲和锑的玻璃料，和（C）溶剂。 玻璃料（B）的重熔温度为320〜360℃，其中重熔温度由DSC曲线中吸热峰值为20J / g以上的吸热峰的顶峰表示， 通过差示扫描量热计。 导电糊还可以包括选自氧化锡，氧化锌，氧化铟和氧化铜中的至少一种金属氧化物（D）。 玻璃料（B）还可以包括（B-1）Ag2O，（B-2）V2O5和（B-3）MoO3。 导电糊可以在相对较低的温度（如370℃或更低）下实现结合，并在相对较高的温度（如300至360℃）保持粘结强度。

公开(公告)号：US10590319B2

公开(公告)日：2020-03-17

申请号：US15746954

申请日：2016-07-15

申请人： NAMICS CORPORATION

发明人： Cathy Shaw Trumble ,  Maciej Patelka ,  Noriyuki Sakai ,  Nicholas C. Krasco

IPC分类号： C09J183/04 ,  C08K3/08 ,  C08L83/04 ,  C08L83/00 ,  C09J11/04 ,  C08G77/04

摘要： A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.

公开(公告)号：US10290601B2

公开(公告)日：2019-05-14

申请号：US15564674

申请日：2016-04-06

申请人： NAMICS CORPORATION

发明人： Raymond Dietz ,  Cathy Shaw Trumble ,  Maciej Patelka ,  Akito Yoshii ,  Noriyuki Sakai ,  Hiroshi Yamaguchi

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L23/40 ,  H01L21/52 ,  C03C4/14 ,  C03C8/02 ,  C03C8/08 ,  C03C8/24 ,  C03C10/00 ,  C03C3/12 ,  C03C3/14 ,  C03C3/21 ,  C03C8/18 ,  C03C27/04

摘要： A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.

公开(公告)号：US20160326044A1

公开(公告)日：2016-11-10

申请号：US15110575

申请日：2015-01-15

申请人： NAMICS CORPORATION

发明人： Raymond Dietz ,  Maciej Patelka ,  Cathy Shaw Trumble ,  Noriyuki Sakai ,  Hiroshi Yamaguchi

IPC分类号： C03C8/24 ,  H01B1/16 ,  C03C4/14 ,  C03C3/12 ,  H01L23/00 ,  C09J9/02

CPC分类号： C03C8/24 ,  C03C3/122 ,  C03C3/125 ,  C03C3/127 ,  C03C4/14 ,  C03C8/02 ,  C03C8/18 ,  C03C2204/00 ,  C03C2205/00 ,  C09J9/02 ,  H01B1/16 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/83851 ,  H01L2224/83948 ,  H01L2924/10272

摘要： A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360° C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) Ag2O, (B-2) V2O5, and (B-3) MoO3. The conductive paste can achieve binding at a relatively low temperature (such as 370° C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360° C.).

摘要翻译： 包含（A）导电颗粒的导电浆料，（B）基本上不含铅，砷，碲和锑的玻璃料，和（C）溶剂。 玻璃料（B）的重熔温度为320〜360℃，其中重熔温度由DSC曲线中吸热峰值为20J / g以上的吸热峰的顶峰表示， 通过差示扫描量热计。 导电糊还可以包括选自氧化锡，氧化锌，氧化铟和氧化铜中的至少一种金属氧化物（D）。 玻璃料（B）还可以包括（B-1）Ag2O，（B-2）V2O5和（B-3）MoO3。 导电糊可以在相对较低的温度（如370℃或更低）下实现结合，并在相对较高的温度（如300至360℃）保持粘结强度。