公开(公告)号：US20230097646A1

公开(公告)日：2023-03-30

申请号：US17802784

申请日：2020-04-24

申请人： NAMICS CORPORATION

发明人： Yuya NAKAI ,  Takashi YAMAGUCHI

IPC分类号： C08G59/40 ,  C08L63/00 ,  C09J163/00

摘要： An object of the present invention is to provide a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. A curing catalyst for epoxy resin, which contains an epoxy imidazole adduct having structural formula (I) below, is prepared. Furthermore, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition are prepared. (In the formula, R1 is a group selected from hydrogen, phenyl, and C1-C17 alkyls, and R2 and R3 are each independently a group selected from hydrogen and C1-C6 alkyls.)

公开(公告)号：US20180079856A1

公开(公告)日：2018-03-22

申请号：US15562255

申请日：2016-03-28

申请人： NAMICS CORPORATION

发明人： Takashi YAMAGUCHI ,  Shinichi ABE

IPC分类号： C08G59/60 ,  H01L21/288 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00

CPC分类号： C08G59/60 ,  C08G59/56 ,  C08G73/12 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J161/34 ,  C09J163/00 ,  C09J179/04 ,  H01L21/288 ,  C08L79/085

摘要： There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.

公开(公告)号：US20180051126A1

公开(公告)日：2018-02-22

申请号：US15562295

申请日：2016-03-28

申请人： NAMICS CORPORATION

发明人： Takashi YAMAGUCHI ,  Shinichi ABE

IPC分类号： C08G59/40 ,  C08K5/3415 ,  C08K5/315

CPC分类号： C08G59/4057 ,  C08G59/56 ,  C08G73/00 ,  C08G73/12 ,  C08K5/3155 ,  C08K5/3415 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C09J9/02 ,  C09J11/00 ,  C09J161/34 ,  C09J179/04 ,  H01L21/288 ,  C08L79/085

摘要： There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide, and (C) bismaleimides.