公开(公告)号：US20020196613A1

公开(公告)日：2002-12-26

申请号：US10176521

申请日：2002-06-24

Applicant: NEC CORPORATION

Inventor： Hideki Seki

IPC: H05K003/30 ,  H05K003/32

CPC classification number: H05K1/184 ,  H05K3/045 ,  H05K3/301 ,  H05K3/403 ,  H05K3/4046 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/10045 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: When an electrode component is inserted into a through hole from one side and then rotated, parts of a conductive film are cut by a cutting blade Another electrode component including a chip component whose one terminal is connected to an electrode of this electrode component is inserted into the through hole from the other side. When compression bonding is applied to the both electrode components so as to be joined together, an electrode of the former electrode component and the electrode of the latter electrode component are spread within the through hole with the pressure. The spread electrode of the former electrode component contacts a portion of the conductive film that is electrically connected to a front surface wiring, and tho spread electrode of the latter electrode component contacts another portion of the conductive film that is electrically connected to a back surface wiring.

Abstract translation: 当电极组件从一侧插入到通孔中然后旋转时，导电膜的一部分被切割刀片切割。另外，包括其一个端子连接到该电极部件的电极的芯片部件的电极部件插入到 通孔从另一边。 当对两个电极部件进行压接以便接合在一起时，前一电极部件的电极和后一电极部件的电极在该压力下在通孔内扩散。 前电极部件的扩散电极与导电膜的与前面布线电连接的部分接触，后电极部件的扩散电极与电连接到背面布线的导电膜的另一部分接触 。