公开(公告)号：US20130256297A1

公开(公告)日：2013-10-03

申请号：US13848776

申请日：2013-03-22

Applicant: NGK INSULATORS, LTD.

Inventor： Kazuhiro NOBORI ,  Takuji KIMURA ,  Reo WATANABE

IPC: H01L21/67

CPC classification number: H01L21/67103 ,  H01L21/6831

Abstract: The electrostatic chuck 10 includes a discoidal alumina ceramic substrate 12 and a heater electrode 14 and an electrostatic electrode 16 embedded in the alumina ceramic substrate 12. The top surface of the alumina ceramic substrate 12 is a wafer-mounting face 12a. The heater electrode 14 has a pattern, for example, of a single continuous line so as to realize electric wiring over the entire surface of the alumina ceramic substrate 12. Upon the application of a voltage, the heater electrode 14 generates heat and heats the wafer W. The heater electrode 14 is made of a complex oxide of titanium, aluminum, and magnesium (Ti—Al—Mg—O) dispersed in molybdenum.

Abstract translation: 静电卡盘10包括盘状氧化铝陶瓷基板12和加热电极14以及嵌入氧化铝陶瓷基板12中的静电电极16.氧化铝陶瓷基板12的顶面是晶片安装面12a。 加热器电极14具有例如单个连续线的图案，以在氧化铝陶瓷基板12的整个表面上实现电布线。在施加电压时，加热器电极14产生热量并加热晶片 加热器电极14由分散在钼中的钛，铝和镁（Ti-Al-Mg-O）的复合氧化物制成。

公开(公告)号：US20190131163A1

公开(公告)日：2019-05-02

申请号：US16231662

申请日：2018-12-24

Applicant: NGK Insulators,LTD.

Inventor： Tatsuya KUNO ,  Reo WATANABE

IPC: H01L21/687 ,  H01L21/683 ,  H01L21/302 ,  H01L21/67 ,  H01J37/32

Abstract: A wafer susceptor includes a conductive member attached to a surface of a plate, a through-hole penetrating through the plate and the conductive member, a screw hole formed in a conductive-member penetrating portion of the through-hole, a stopper surface formed in the conductive member, an insulation pipe screwed into the screw hole, and an insulating sealing member arranged between a plate-facing surface of the insulation pipe and the plate, wherein, with a contact surface of the insulation pipe coming into contact with the stopper surface of the conductive member, the insulation pipe is prevented from further advancing into the screw hole, a fore end surface of a sealing-member support portion of the insulation pipe is positioned at a predetermined position where the fore end surface does not contact the plate, and the sealing member is pressed between the plate-facing surface of the insulation pipe and the plate.

公开(公告)号：US20230402306A1

公开(公告)日：2023-12-14

申请号：US18298404

申请日：2023-04-11

Applicant: NGK INSULATORS, LTD.

Inventor： Reo WATANABE ,  Daisuke TSUNEKAWA ,  Kanto WATANABE

IPC: H01L21/677 ,  H01L21/683

CPC classification number: H01L21/67778 ,  H01L21/683

Abstract: A wafer placement table includes: a ceramic substrate having a wafer placement surface and incorporating an electrode; a conductive embedded member electrically connected to the electrode; a conductive terminal with a female thread, the conductive terminal being electrically connected to the conductive embedded member, having a projection projecting from a surface, on an opposite side to the wafer placement surface, of the ceramic substrate, having the female thread at an end face of the projection; a conductive adapter that is mounted on the end face of the projection of the conductive terminal with the female thread, has a communication hole that communicates with the female thread, and is non-rotatable relative to the conductive terminal with the female thread; and a conductive connection member with a male thread, the conductive connection member having the male thread screwed into the female thread through the communication hole, and being integrated with the adapter.

公开(公告)号：US20220124875A1

公开(公告)日：2022-04-21

申请号：US17305170

申请日：2021-07-01

Applicant: NGK INSULATORS, LTD.

Inventor： Yuma IWATA ,  Seiya INOUE ,  Reo WATANABE

IPC: H05B3/06 ,  H05B1/02 ,  H05B3/28 ,  H05B3/03

Abstract: A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, and a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The power-supplying member includes a redirecting portion where the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.

公开(公告)号：US20220124874A1

公开(公告)日：2022-04-21

申请号：US17305173

申请日：2021-07-01

Applicant: NGK INSULATORS, LTD.

Inventor： Seiya INOUE ,  Reo WATANABE ,  Yuma IWATA

IPC: H05B1/02 ,  H01L21/687 ,  H05B3/03 ,  H05B3/14 ,  H05B3/26

Abstract: A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached, and a redirecting member provided inside the ceramic shaft. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The redirecting member holds the power-supplying member such that the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.

公开(公告)号：US20200312696A1

公开(公告)日：2020-10-01

申请号：US16901384

申请日：2020-06-15

Applicant: NGK INSULATORS, LTD.

Inventor： Yutaka UNNO ,  Reo WATANABE

IPC: H01L21/683 ,  H01L21/67

Abstract: An electrostatic-chuck heater is a Johnsen-Rahbek electrostatic-chuck heater and is used in a process of forming a conductive film on a wafer. The electrostatic-chuck heater includes a disc-shaped ceramic base including an electrostatic electrode and a heating resistor, and a hollow shaft attached to a side of the ceramic base that is opposite a wafer-mounting surface. A protruding ring is provided on the wafer-mounting surface and having an outside diameter smaller than a diameter of the wafer. A through-hole extends in a peripheral wall of the hollow shaft from a lower end through to an area of the wafer-mounting surface that is on an inner side with respect to the protruding ring. The through-hole allows gas to be supplied from the lower end of the hollow shaft into a below-wafer space enclosed by the wafer-mounting surface, the protruding ring, and the wafer mounted on the wafer-mounting surface.