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公开(公告)号：US11121297B2
公开(公告)日：2021-09-14
申请号：US16455620
申请日：2019-06-27
申请人： Nichia Corporation
发明人： Kenji Ozeki , Atsushi Kojima , Chinami Nakai
摘要： A method of manufacturing a light emitting device includes: mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess; forming a first reflecting layer by covering lateral surfaces defining the recess with a first resin containing a first reflecting material; forming a second reflecting layer covering the bottom surface defining the recess, wherein the step of forming the second reflecting layer comprises settling the second reflecting material in the second resin by a centrifugal force so as to form (i) a layer containing a second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material; and disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, the phosphor-containing layer comprising a third resin that contains a phosphor.
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公开(公告)号：US11171260B2
公开(公告)日：2021-11-09
申请号：US16586270
申请日：2019-09-27
申请人： NICHIA CORPORATION
发明人： Kenji Ozeki , Atsushi Kojima , Chinami Nakai , Yoshio Ichihara
摘要： A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.
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公开(公告)号：US11164991B2
公开(公告)日：2021-11-02
申请号：US16724007
申请日：2019-12-20
申请人： NICHIA CORPORATION
发明人： Kenji Ozeki , Atsushi Kojima , Chinami Nakai
摘要： A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a mounting board on which the light emitting elements are disposed; a first cover member located on or above the mounting board, the first cover member comprising: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements and comprising a second reflective material.
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4.发明授权公开(公告)号：US11362248B2
公开(公告)日：2022-06-14
申请号：US16928233
申请日：2020-07-14
申请人： NICHIA CORPORATION
发明人： Atsushi Kojima , Kenji Ozeki , Chinami Nakai
摘要： A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.
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公开(公告)号：US11616179B2
公开(公告)日：2023-03-28
申请号：US17513254
申请日：2021-10-28
申请人： NICHIA CORPORATION
发明人： Kenji Ozeki , Atsushi Kojima , Chinami Nakai
摘要： A method of manufacturing a light emitting device that comprises a first cover member and a second cover member, includes: providing a package that comprises a substrate, a plurality of resin walls, and a recessed part defined by an upper surface of the substrate and lateral surfaces of the plurality of resin walls, wherein the substrate includes a grooved part surrounding a first region; mounting a light emitting element in the first region; forming the second cover member in a region between the lateral surfaces defining the recessed part to an upper edge of an outer perimeter of the grooved part; forming the first cover member, which comprises depositing an uncured resin on the second cover member, and allowing the uncured resin to flow into a groove of the grooved part; and forming a light transmitting member on the first cover member and the light emitting element.
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公开(公告)号：US11043621B2
公开(公告)日：2021-06-22
申请号：US16506125
申请日：2019-07-09
申请人： NICHIA CORPORATION
发明人： Masato Aihara , Kenji Ozeki , Atsushi Kojima , Chinami Nakai , Kazuya Tamura
IPC分类号： H01L33/60 , H01L25/075 , H01L33/62 , H01L33/64
摘要： A light emitting device includes: a light emitting element; a first reflecting member containing reflecting particles, and covering the upper surface of a base while exposing a light extraction surface of the light emitting element; a first cover member having a lower concentration of reflecting particles than the first reflecting member and covering the first reflecting member and a portion of lateral surfaces of the light emitting element while exposing the light extraction surface of the light emitting element; a second cover member covering a portion of the lateral surfaces of the light emitting element; a second reflecting member surrounding the second cover member in a top view and contacting the second cover member and the first reflecting member; the second reflecting member having a narrow-width portion being in contact with the first reflecting member and a wide-width portion located above the narrow-width portion in a cross-sectional view.
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公开(公告)号：US11189765B2
公开(公告)日：2021-11-30
申请号：US16726394
申请日：2019-12-24
申请人： NICHIA CORPORATION
发明人： Kenji Ozeki , Atsushi Kojima , Chinami Nakai
摘要： A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element.
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8.发明申请公开(公告)号：US20210028339A1
公开(公告)日：2021-01-28
申请号：US16928233
申请日：2020-07-14
申请人： NICHIA CORPORATION
发明人： Atsushi Kojima , Kenji Ozeki , Chinami Nakai
摘要： A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.
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