公开(公告)号：US11171260B2

公开(公告)日：2021-11-09

申请号：US16586270

申请日：2019-09-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai ,  Yoshio Ichihara

IPC: H01L33/44 ,  H01L33/56 ,  H01L33/60 ,  H01L33/54

Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

公开(公告)号：US10002997B2

公开(公告)日：2018-06-19

申请号：US15487578

申请日：2017-04-14

Applicant: NICHIA CORPORATION

Inventor： Yoshio Ichihara ,  Takeo Kurimoto

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame for a light emitting device includes a plurality of unit regions and a plurality of suspension pins. Each of the unit regions each includes first to third leads. The suspension pins defines substantially rectangular frames each surrounding a corresponding one of the unit regions. The suspension pins link adjacent ones of the unit regions. In each of the unit regions, the first lead is disposed near a first corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a first extension, the second lead is disposed near a second corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a second extension, and the third lead includes at least two third extensions respectively linked to opposing sides of the substantially rectangular frame.

公开(公告)号：US10763407B2

公开(公告)日：2020-09-01

申请号：US16369715

申请日：2019-03-29

Applicant: NICHIA CORPORATION

Inventor： Yoshio Ichihara ,  Mitsuhiro Isono

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/56 ,  H01L33/60 ,  H01L23/00 ,  H01L33/62 ,  H01L23/16 ,  H01L23/31 ,  H01L23/04 ,  H01L23/02 ,  H01L23/28 ,  H01L33/44 ,  H01L23/10 ,  H01L33/52

Abstract: Alight emitting device includes a package, alight emitting element, and a light-transmissive encapsulant. The package has a top surface and a recessed portion formed with an opening at the top surface. The light emitting element is located on a bottom surface of the recessed portion. The light-transmissive encapsulant is supplied in the recessed portion. The package is provided with a groove formed in the top surface and surrounding the opening. A surface of the groove includes depressed portions and projecting portions. The encapsulant covers at least a part of the surface of the groove, and a portion of the encapsulant that covers the surface of the groove includes a surface irregularity.

公开(公告)号：US10355187B2

公开(公告)日：2019-07-16

申请号：US15974097

申请日：2018-05-08

Applicant: NICHIA CORPORATION

Inventor： Yoshio Ichihara ,  Takeo Kurimoto

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/56 ,  H01L23/00 ,  H01L25/075

Abstract: A package for a light emitting device includes a resin molding and a first lead. The resin molding defines a recess opening at the upper surface of the resin molding. The first lead includes first and second lower exposed surfaces and an upper exposed surface. The first and second lower exposed surfaces are exposed from the resin molding at the lower surface of the resin molding. The first and second lower exposed surfaces are spaced apart from each other with the resin molding being interposed therebetween. The upper exposed surface is exposed from the resin molding at a bottom surface of the recess of the resin molding. In a plan view, the upper exposed surface includes a concave portion in a region corresponding to a region between the first and second lower exposed surfaces, with the concave portion being filled with the resin molding.

公开(公告)号：US09666777B2

公开(公告)日：2017-05-30

申请号：US14721218

申请日：2015-05-26

Applicant: NICHIA CORPORATION

Inventor： Yoshio Ichihara ,  Takeo Kurimoto

IPC: H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package for a light emitting device includes a resin molding and first to third leads. The first lead is disposed near a first corner of a substantially rectangular shape of the resin molding, and has a first exposed part exposed from one of two side surfaces that share the first corner while the first lead is not exposed from the resin molding on the other of the two side surfaces. The second lead is disposed near a second corner, and has a second exposed part exposed from one of two side surfaces that share the second corner while the second lead is not exposed from the resin molding on the other of the two side surfaces. The third lead has a plurality of lower surface exposed parts that are exposed from a lower surface of the resin molding.

公开(公告)号：US09583422B2

公开(公告)日：2017-02-28

申请号：US15002640

申请日：2016-01-21

Applicant: SH MATERIALS CO., LTD. ,  NICHIA CORPORATION

Inventor： Katsuyuki Doumae ,  Yoshio Ichihara ,  Shimpei Sasaoka

IPC: H01L23/495

CPC classification number: H01L23/49544 ,  H01L23/49503 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame, as one product unit in a multi-row lead frame sharing a partition frame among other lead frames, has a non-mirrorsymmetric pad region and at least one terminal region arranged inside and held to a rectangular outer frame region, which is a part of the partition frame and forms a boundary of the lead frame as a product unit, via respective suspension leads. Only two suspension leads hold the non-mirrorsymmetric pad region to the outer frame region as extending from opposite sides of the outer frame region to the non-mirrorsymmetric pad region, respectively. This structure decreases stress resulting from holding of the non-mirrorsymmetric pad region to the outer frame region and thus can prevent the outer frame region from deformation without widened connecting bars or dambars, which form the outer frame region.

Abstract translation: 作为在其他引线框架中共享分隔框架的多行引线框架中的一个产品单元的引线框架具有非反射对称焊盘区域和布置在内部并保持在矩形外框区域中的至少一个端子区域，其中， 分隔框架的一部分，并通过各自的悬挂引线形成作为产品单元的引线框架的边界。 只有两个悬挂引线将非反射对称焊盘区域保持到外框区域，分别从外框区域的相对侧延伸到非反射对称焊盘区域。 这种结构减小了由于将非反射对称垫区域保持在外框区域而产生的应力，从而可防止外框区域变形，而不会形成外框架区域的加宽的连接条或堰。

公开(公告)号：US11955466B2

公开(公告)日：2024-04-09

申请号：US17410179

申请日：2021-08-24

Applicant: NICHIA CORPORATION

Inventor： Yoshio Ichihara

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A light emitting device includes a package for surface mounting, the package including at least three leads defining a first recess, a second recess, and a third recess. A first light emitting element is disposed in the first recess and emits first light, a second light emitting element is disposed in the second recess and emits second light, and a third light emitting element is disposed in the third recess and emits third light. A first colored resin member is disposed in the first recess, a second colored resin member is disposed in the second recess, and a third colored resin member is disposed in the third. A mold resin including a first lens portion, a second lens portion, and a third lens portion each overlapping a recess of a respective one of the plurality of leads.

公开(公告)号：US20160218051A1

公开(公告)日：2016-07-28

申请号：US15002640

申请日：2016-01-21

Applicant: SH MATERIALS CO., LTD. ,  NICHIA CORPORATION

Inventor： Katsuyuki Doumae ,  Yoshio Ichihara ,  Shimpei Sasaoka

IPC: H01L23/495

CPC classification number: H01L23/49544 ,  H01L23/49503 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame, as one product unit in a multi-row lead frame sharing a partition frame among other lead frames, has a non-mirrorsymmetric pad region and at least one terminal region arranged inside and held to a rectangular outer frame region, which is a part of the partition frame and forms a boundary of the lead frame as a product unit, via respective suspension leads. Only two suspension leads hold the non-mirrorsymmetric pad region to the outer frame region as extending from opposite sides of the outer frame region to the non-mirrorsymmetric pad region, respectively. This structure decreases stress resulting from holding of the non-mirrorsymmetric pad region to the outer frame region and thus can prevent the outer frame region from deformation without widened connecting bars or dambars, which form the outer frame region.

Abstract translation: 作为在其他引线框架中共享分隔框架的多行引线框架中的一个产品单元的引线框架具有非反射对称焊盘区域和布置在内部并保持在矩形外框区域中的至少一个端子区域，其中， 分隔框架的一部分，并通过各自的悬挂引线形成作为产品单元的引线框架的边界。 只有两个悬挂引线将非反射对称焊盘区域保持到外框区域，分别从外框区域的相对侧延伸到非反射对称焊盘区域。 这种结构减小了由于将非反射对称垫区域保持在外框区域而产生的应力，从而可防止外框区域变形，而不会形成外框架区域的加宽的连接条或堰。