公开(公告)号：US11616179B2

公开(公告)日：2023-03-28

申请号：US17513254

申请日：2021-10-28

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L25/16 ,  H01L29/866 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device that comprises a first cover member and a second cover member, includes: providing a package that comprises a substrate, a plurality of resin walls, and a recessed part defined by an upper surface of the substrate and lateral surfaces of the plurality of resin walls, wherein the substrate includes a grooved part surrounding a first region; mounting a light emitting element in the first region; forming the second cover member in a region between the lateral surfaces defining the recessed part to an upper edge of an outer perimeter of the grooved part; forming the first cover member, which comprises depositing an uncured resin on the second cover member, and allowing the uncured resin to flow into a groove of the grooved part; and forming a light transmitting member on the first cover member and the light emitting element.

公开(公告)号：US11043621B2

公开(公告)日：2021-06-22

申请号：US16506125

申请日：2019-07-09

Applicant: NICHIA CORPORATION

Inventor： Masato Aihara ,  Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai ,  Kazuya Tamura

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64

Abstract: A light emitting device includes: a light emitting element; a first reflecting member containing reflecting particles, and covering the upper surface of a base while exposing a light extraction surface of the light emitting element; a first cover member having a lower concentration of reflecting particles than the first reflecting member and covering the first reflecting member and a portion of lateral surfaces of the light emitting element while exposing the light extraction surface of the light emitting element; a second cover member covering a portion of the lateral surfaces of the light emitting element; a second reflecting member surrounding the second cover member in a top view and contacting the second cover member and the first reflecting member; the second reflecting member having a narrow-width portion being in contact with the first reflecting member and a wide-width portion located above the narrow-width portion in a cross-sectional view.

公开(公告)号：US11996502B2

公开(公告)日：2024-05-28

申请号：US16817796

申请日：2020-03-13

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/52 ,  H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/52 ,  H01L33/005 ,  H01L33/502 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/005

Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.

公开(公告)号：US11121297B2

公开(公告)日：2021-09-14

申请号：US16455620

申请日：2019-06-27

Applicant: Nichia Corporation

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess; forming a first reflecting layer by covering lateral surfaces defining the recess with a first resin containing a first reflecting material; forming a second reflecting layer covering the bottom surface defining the recess, wherein the step of forming the second reflecting layer comprises settling the second reflecting material in the second resin by a centrifugal force so as to form (i) a layer containing a second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material; and disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, the phosphor-containing layer comprising a third resin that contains a phosphor.

公开(公告)号：US11757078B2

公开(公告)日：2023-09-12

申请号：US17398860

申请日：2021-08-10

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a package in which a recess is defined; a light emitting element mounted on a bottom surface defining the recess; a first reflecting layer covering lateral surfaces defining the recess; and a second reflecting layer covering the bottom surface defining the recess, wherein the second reflecting layer is in contact with the first reflecting layer, wherein at least a portion of lateral surfaces of the light emitting element is exposed from the second reflecting layer.

公开(公告)号：US11362248B2

公开(公告)日：2022-06-14

申请号：US16928233

申请日：2020-07-14

Applicant: NICHIA CORPORATION

Inventor： Atsushi Kojima ,  Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48

Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.

公开(公告)号：US10910515B2

公开(公告)日：2021-02-02

申请号：US16666698

申请日：2019-10-29

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/00 ,  H01L33/56 ,  H01L51/56 ,  H01L25/13 ,  H01L23/31

Abstract: A method of manufacturing a light-emitting device includes providing a package having an upper surface and defining a recess, the recess having an opening at the upper surface. A light-emitting element is placed on a bottom surface of the recess of the package, and the recess of the package is filled with an uncured sealing member containing a silicone resin. The package is held in a liquid in a state in which the uncured sealing member is filled in the recess of the package, and the uncured sealing member is cured by heating the package in which the uncured sealing member is filled in the recess.

公开(公告)号：US11764342B2

公开(公告)日：2023-09-19

申请号：US17489338

申请日：2021-09-29

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/52 ,  H01L33/00 ,  H01L21/77 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/58 ,  H01L21/77 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes: a mounting board; a plurality of light emitting elements disposed on the mounting board; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a first cover member located on or above the mounting board, the first cover member including: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements.

公开(公告)号：US11171260B2

公开(公告)日：2021-11-09

申请号：US16586270

申请日：2019-09-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai ,  Yoshio Ichihara

IPC: H01L33/44 ,  H01L33/56 ,  H01L33/60 ,  H01L33/54

Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

公开(公告)号：US11164991B2

公开(公告)日：2021-11-02

申请号：US16724007

申请日：2019-12-20

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/52 ,  H01L21/77

Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a mounting board on which the light emitting elements are disposed; a first cover member located on or above the mounting board, the first cover member comprising: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements and comprising a second reflective material.