公开(公告)号：US20210013387A1

公开(公告)日：2021-01-14

申请号：US16922868

申请日：2020-07-07

Applicant: NICHIA CORPORATION

Inventor： Kazuya MATSUDA ,  Naofumi SUMITANI

IPC: H01L33/62 ,  H01L23/495

Abstract: A lead frame includes a plurality of unit structures, an outer frame, a plurality of extending portions, and a plurality of coupling portions. The unit structures each includes a first lead portion and a second lead portion aligned in a first direction, and grouped into first and second groups including a plurality of the unit structures aligned in the first direction. The extending portions each includes a first extending portion extending in the second direction and connecting the first lead portions of the unit structures in the first and second groups a second extending portion connecting the second lead portions of the unit structures in the first and second groups. The coupling portions connect all the first extending portions and the second extending portions. At least one of the extending portions located at one of ends in the first direction is not directly connected to the outer frame.

公开(公告)号：US20220384694A1

公开(公告)日：2022-12-01

申请号：US17804290

申请日：2022-05-26

Applicant: NICHIA CORPORATION

Inventor： Yuta HORIKAWA ,  Akihiro FUJIOKA ,  Kazuya MATSUDA

IPC: H01L33/56 ,  H01L33/62 ,  H01L25/075 ,  H01L33/50

Abstract: A light emitting device includes a resin package including a first lead, a second lead, a resin portion holding the first lead and the second lead, at least one light emitting element mounted on the resin package, and a covering member covering at least a portion of an upper surface of each of the first lead, the second lead, and the resin portion. The resin portion includes at least one resin recess between the first lead and the second lead. At least a portion of the resin recess is located between a first portion of the first lead and a second portion of the second lead in a first direction, and is located between a first extended portion of the first lead and a second extended portion of the second lead in a second direction, and at least a portion of the resin recess is covered by the covering member.

公开(公告)号：US20220102596A1

公开(公告)日：2022-03-31

申请号：US17489475

申请日：2021-09-29

Applicant: NICHIA CORPORATION

Inventor： Kazuya MATSUDA ,  Atsushi BANDO

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each configured to be independently driven; a wall portion located between the first light-emitting element and the second light-emitting element; a first light-transmissive member separated from the second light-emitting element by the wall portion and covering at least a portion of lateral surfaces of the first light-emitting element, wherein the first light-transmissive member contains a first wavelength converting member; and a second light-transmissive member covering the first light-emitting element, the second light-emitting element, and the first light-transmissive member in a plan view, wherein the second light-transmissive member contains a second wavelength converting member. A peak emission wavelength of the first wavelength converting member is longer than a peak emission wavelength of the second wavelength converting member.

公开(公告)号：US20190165222A1

公开(公告)日：2019-05-30

申请号：US16200635

申请日：2018-11-26

Applicant: NICHIA CORPORATION

Inventor： Atsushi BANDO ,  Kazuya MATSUDA

IPC: H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; and a sealing member covering the first light-emitting element and the second light-emitting element, the sealing member containing a first fluorescent material. The first light-emitting element and the second light-emitting element are configured to be individually driven. The sealing member includes a protruding portion at an upper surface thereof. The first light-emitting element is disposed in a first region, which is located under the protruding portion. The second light-emitting element is disposed in a second region, which is located under the upper surface of the sealing member at a position different from the first region.

公开(公告)号：US20190103525A1

公开(公告)日：2019-04-04

申请号：US16143349

申请日：2018-09-26

Applicant: Nichia Corporation

Inventor： Atsushi BANDO ,  Kazuya MATSUDA

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L27/15

Abstract: A light emitting device includes: a first light emitting element and a second light emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; a first light transmissive member disposed on an upper face of the first light emitting element and containing a first phosphor; a second light transmissive member disposed on an upper face of the second light emitting element; and an encapsulant covering the first light transmissive member and the second light transmissive member and containing a second phosphor. The first light emitting element and the second light emitting element are configured to be independently driven. A chromaticity of light exiting from the first light transmissive member differs from a chromaticity of light exiting from the second light transmissive member.

公开(公告)号：US20250002783A1

公开(公告)日：2025-01-02

申请号：US18828874

申请日：2024-09-09

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: C09K11/77 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01S5/0232

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

公开(公告)号：US20240372044A1

公开(公告)日：2024-11-07

申请号：US18773873

申请日：2024-07-16

Applicant: NICHIA CORPORATION

Inventor： Kazuya MATSUDA ,  Atsushi BANDO

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each configured to be independently driven; a wall portion located between the first light-emitting element and the second light-emitting element; a lateral resin portion entirely surrounding the first light-emitting element and the second light-emitting element; a first light-transmissive member that is separated from the second light-emitting element by the wall portion, covers at least a portion of lateral surfaces of the first light-emitting element, and contains a first wavelength converting member; and a second light-transmissive member that covers the first light-emitting element, the second light-emitting element, and the first light-transmissive member in a plan view, and contains a second wavelength converting member.

公开(公告)号：US20230002637A1

公开(公告)日：2023-01-05

申请号：US17756634

申请日：2020-11-20

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: C09D179/02 ,  H01L33/48 ,  H01L33/52

Abstract: A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

公开(公告)号：US20220005986A1

公开(公告)日：2022-01-06

申请号：US17478376

申请日：2021-09-17

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/56 ,  H01L23/495 ,  H01L33/62

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.

公开(公告)号：US20220140213A1

公开(公告)日：2022-05-05

申请号：US17576221

申请日：2022-01-14

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  C09K11/77 ,  H01S5/0231

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.