公开(公告)号：US20190067541A1

公开(公告)日：2019-02-28

申请号：US16043364

申请日：2018-07-24

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  C25D3/46 ,  C25D5/10

CPC classification number: H01L33/62 ,  C25D3/46 ,  C25D5/10 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A lead frame includes a base material and two or more silver-containing layers. The base material is composed of a metal. The two or more silver-containing layers are stacked on the base material. The two or more silver-containing layers includes an uppermost silver-containing layer containing sulfur, and a lower silver-containing layer. The lower silver-containing layer contains no selenium or the lower silver-containing layer is composed substantially only of silver. A method for manufacturing a light emitting device includes: preparing a lead frame; preparing a package including the lead frame; and mounting a light emitting element on the package. The lead frame is prepared by: providing a base material; forming an underlying metal on the base material by plating to form an underlayer; and forming two or more silver-containing stacked layers on the underlayer, the two or more silver-containing stacked layers including an uppermost silver-containing layer containing sulfur.

公开(公告)号：US20250002783A1

公开(公告)日：2025-01-02

申请号：US18828874

申请日：2024-09-09

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: C09K11/77 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01S5/0232

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

公开(公告)号：US20230002637A1

公开(公告)日：2023-01-05

申请号：US17756634

申请日：2020-11-20

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: C09D179/02 ,  H01L33/48 ,  H01L33/52

Abstract: A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

公开(公告)号：US20220005986A1

公开(公告)日：2022-01-06

申请号：US17478376

申请日：2021-09-17

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/56 ,  H01L23/495 ,  H01L33/62

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.

公开(公告)号：US20180226550A1

公开(公告)日：2018-08-09

申请号：US15943432

申请日：2018-04-02

Applicant: NICHIA CORPORATION

Inventor： Masakazu SAKAMOTO ,  Yoshiki SATO ,  Yasuo KATO

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01004

Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 μm to 0.5 μm.

公开(公告)号：US20180097162A1

公开(公告)日：2018-04-05

申请号：US15721377

申请日：2017-09-29

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/60 ,  H01L33/0095 ,  H01L33/502 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/97 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a light emitting element; and a light reflective member adapted to reflect light emitted from the light emitting element, the light reflective member comprising a base metal made of a crystallized metal, an amorphous layer located over the base metal and made of an amorphous metal, and an Ag-containing layer located over the amorphous layer.

公开(公告)号：US20220140213A1

公开(公告)日：2022-05-05

申请号：US17576221

申请日：2022-01-14

Applicant: NICHIA CORPORATION

Inventor： Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  C09K11/77 ,  H01S5/0231

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

公开(公告)号：US20200243710A1

公开(公告)日：2020-07-30

申请号：US16774565

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki TANAKA ,  Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/00 ,  H01L25/075

Abstract: A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including: disposing at least one light-emitting element on the first plating located at the upward-facing surface of each of the plurality of recesses; and disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of individual light emitting devices.

公开(公告)号：US20200212274A1

公开(公告)日：2020-07-02

申请号：US16720681

申请日：2019-12-19

Applicant: NICHIA CORPORATION

Inventor： Kazuya MATSUDA ,  Yasuo KATO ,  Hiroyuki TANAKA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/46 ,  H01L33/48

Abstract: A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.

公开(公告)号：US20200176649A1

公开(公告)日：2020-06-04

申请号：US16698324

申请日：2019-11-27

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki TANAKA ,  Yasuo KATO ,  Kazuya MATSUDA

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in which the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, the first plated layer on the upper surface of the metal part is located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including; disposing at least one light-emitting element on the upward-facing surface each of the plurality of recesses, disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of discrete light emitting devices.