公开(公告)号：US20140322844A1

公开(公告)日：2014-10-30

申请号：US14263695

申请日：2014-04-28

Applicant: NICHIA CORPORATION

Inventor： Masatsuga Ichikawa ,  Masahiko Sano ,  Daisuke Sanga ,  Toru Takasone ,  Shunsuke Minato

IPC: H01L33/50

CPC classification number: H01L33/0079 ,  H01L33/505 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.

Abstract translation: 提供一种制造包括发光元件和光学部件的发光器件的方法，所述方法包括以下步骤：（i）在每个发光元件和光学部件的接合表面上形成羟基膜， 原子层沉积，和（ii）将发光元件和光学部件的结合面彼此粘合，每个接合表面上形成有羟基膜，其中子步骤在该步骤中重复至少一次（ i），其中第一原料气体和第二原料气体顺序地供应到发光元件和光学部件的接合表面上，并且其中执行步骤（ii）中的接合表面的接合 没有加热处理。