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1.发明申请公开(公告)号：US20220399624A1
公开(公告)日：2022-12-15
申请号：US17775517
申请日：2019-11-13
发明人： Hiromasa Tanobe , Josuke Ozaki
摘要： A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.
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公开(公告)号：US20220384928A1
公开(公告)日：2022-12-01
申请号：US17772446
申请日：2019-10-29
发明人： Hiromasa Tanobe , Josuke Ozaki
摘要： A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.
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公开(公告)号：US20220066281A1
公开(公告)日：2022-03-03
申请号：US17429005
申请日：2019-02-14
摘要： Phase modulation electrode lines of a semiconductor Mach-Zehnder optical modulator are formed along waveguides. Output-side lead lines are bent in a direction crossing the extending direction of the waveguides in the plane of a dielectric layer and are connected to terminal resistors. The output-side lead lines are formed in a predetermined width corresponding to a desired impedance and make the width narrower than the predetermined width only in the bent portions and portions where the output-side lead lines crosses the waveguides.
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公开(公告)号：US11971590B2
公开(公告)日：2024-04-30
申请号：US17768695
申请日：2019-10-29
发明人： Yasuaki Hashizume , Yoshihiro Ogiso , Josuke Ozaki
CPC分类号： G02B6/422 , G02B6/4227 , G02F1/225 , G02B6/29353 , G02B6/29355 , G02B6/32
摘要： In the adjustment method of optical coupling for an optical integrated circuit according to the present disclosure, the optimal adjustment position of optical coupling is determined on the basis of, for example, a sum of a plurality of photocurrents at electrodes on arm waveguides respectively formed on the plurality of MZIs in the polarization-multiplexing IQ modulator. According to the maximum value of the sum of the plurality of photocurrents, the light condensing spot position is adjusted to the center position of the end face core of the optical waveguide of the integrated chip. Typically, the light condensing spot position is adjusted to the center of the end face core by displacing the two input lenses.
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公开(公告)号：US11467467B2
公开(公告)日：2022-10-11
申请号：US17050797
申请日：2019-05-08
发明人： Josuke Ozaki , Shigeru Kanazawa , Hiromasa Tanobe
摘要： Reflection between a Mach-Zehnder modulator and a termination resistor is suppressed. An optical modulator includes a differential drive open collector driver IC, a differential drive semiconductor Mach-Zehnder modulator, and a differential terminator. The Mach-Zehnder modulator includes waveguides and a differential high-frequency line. The differential terminator includes a differential high-frequency line and termination resistors. The differential high-frequency line includes a capacity provided at least one of between signal lines and between a signal line and a ground line.
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公开(公告)号：US11106108B2
公开(公告)日：2021-08-31
申请号：US16605164
申请日：2018-04-17
发明人： Josuke Ozaki , Yoshihiro Ogiso , Norihide Kashio
摘要： A semiconductor MZM of the present invention includes the first and second signal electrodes formed to be parallel to the first and second arm waveguides, respectively; the first and second phase modulation electrodes that are branched from the first and second signal electrodes and that are provided on the first and second arm waveguides in a discrete manner along the first and second signal electrodes; the first and second ground electrodes formed parallelly along the first and second signal electrodes; and a plurality of connection wirings to connect the first and second ground electrodes between a plurality of points. A differential signal is inputted to or outputted from the first and second signal electrodes. The plurality of connection wirings adjacent to each other are arranged with an interval ¼ times smaller than wavelength of a signal propagated through the first and second signal electrodes.
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公开(公告)号：US20210232016A1
公开(公告)日：2021-07-29
申请号：US17051532
申请日：2019-04-18
发明人： Yoshihiro Ogiso , Yuta Ueda , Josuke Ozaki
摘要： A Mach-Zehnder modulator is enabled to perform high-speed modulation operation by reducing RF loss of a high-frequency wiring formed on an optical waveguide without deteriorating optical characteristics of branching and multiplexing optical circuits. The Mach-Zehnder modulator includes a Mach-Zehnder (MZ) optical waveguide including two arm waveguides, a 1×2 multimode interference coupler composed of a semiconductor that splits and distributes input light to the two arm waveguides, a 2×1 multimode interference coupler composed of a semiconductor that multiplexes light from the two arm waveguides, and phase modulation means for giving a phase difference to the light that propagates through the two arm waveguides, wherein the 1×2 multimode interference coupler and the 2×1 multimode interference coupler are formed in a high-mesa structure, and higher mode light radiation means for radiating higher mode light is connected to only the 2×1 multimode interference coupler among the two multimode interference couplers.
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公开(公告)号：US10522892B2
公开(公告)日：2019-12-31
申请号：US15737214
申请日：2016-06-24
发明人： Nobuhiro Kikuchi , Eiichi Yamada , Yoshihiro Ogiso , Josuke Ozaki
摘要： This invention provides a high-frequency line adopting a structure to suppress an impedance variation and occurrence of an excessive power loss in high-frequency wiring having intersection with an optical waveguide. A high-frequency line is a microstrip line which has a basic configuration of stacking a ground electrode, a dielectric layer, and a signal electrode in this order on a SI-InP substrate. In addition, as shown in a transverse sectional view, an optical waveguide core made of InP-based semiconductor intersects with the high-frequency line in a crossing manner. A width of the signal electrode is partially increased in a certain region covering the intersection with the optical waveguide along a propagating direction of the high-frequency line. In the microstrip line, the width of the signal electrode is partially increased from w1 to w2, and characteristic impedance is thus reduced as compared to one with the uniform width w1.
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公开(公告)号：US12066736B2
公开(公告)日：2024-08-20
申请号：US17772891
申请日：2019-10-29
发明人： Hiromasa Tanobe , Josuke Ozaki
CPC分类号： G02F1/212 , G02F1/2257
摘要： An optical module includes: a Peltier module; an optical semiconductor element mounted on the Peltier module; and a driver that drives high-frequency lines of the optical semiconductor element. The optical semiconductor element includes: optical circuits providing a function of an optical interferometer and the high-frequency lines. Cooling performance of the Peltier module in a region in vicinity of the driver is higher than the cooling performance in other regions.
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公开(公告)号：US20230069120A1
公开(公告)日：2023-03-02
申请号：US17793768
申请日：2020-02-28
IPC分类号： H04B10/80 , H04B10/40 , H04B10/2575
摘要： Provided is a high-speed optical transmission-reception apparatus including a digital-signal processing circuit and optical modulation and optical reception modules, in which a flexible printed circuit is used as a high-frequency interface for the optical modulation and optical reception modules, a mechanism for connecting the high-frequency line pattern to the flexible printed circuit is provided on a package substrate of the digital-signal processing circuit, and the package substrate and the optical modulation and optical reception modules are connected by the flexible printed circuit.
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