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公开(公告)号：US20220390497A1
公开(公告)日：2022-12-08
申请号：US17770017
申请日：2019-10-29
摘要： A high-frequency noise detection antenna is provided with a fine coaxial line that includes a center conductor, an insulator provided so as to surround the whole periphery of the center conductor, and a ground shield provided so as to surround the whole periphery of the insulator, and in which a tip of the center conductor is exposed so as to protrude from the end of the insulator and the end of the ground shield, and an exposed ground shield provided so as to protrude from the end of the ground shield and surround a part in a circumferential direction of an exposed portion from which the center conductor protrudes.
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公开(公告)号：US11467467B2
公开(公告)日：2022-10-11
申请号：US17050797
申请日：2019-05-08
发明人： Josuke Ozaki , Shigeru Kanazawa , Hiromasa Tanobe
摘要： Reflection between a Mach-Zehnder modulator and a termination resistor is suppressed. An optical modulator includes a differential drive open collector driver IC, a differential drive semiconductor Mach-Zehnder modulator, and a differential terminator. The Mach-Zehnder modulator includes waveguides and a differential high-frequency line. The differential terminator includes a differential high-frequency line and termination resistors. The differential high-frequency line includes a capacity provided at least one of between signal lines and between a signal line and a ground line.
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公开(公告)号：US20230314740A1
公开(公告)日：2023-10-05
申请号：US18005883
申请日：2020-08-07
发明人： Hitoshi Wakita , Kota Shikama , Hiromasa Tanobe , Yuzo Ishii , Yoshiyuki Doi , Satoshi Tsunashima
IPC分类号： G02B6/42 , H01L25/16 , H01L23/498 , H01L21/48 , H01S5/02251
CPC分类号： G02B6/4274 , H01L25/167 , H01L23/49822 , H01L21/4857 , H01S5/02251
摘要： A module includes an electrical wiring layer, an optical wiring layer, an electrical element, and an optical element. The electrical wiring layer includes electrical wiring lines for propagating electrical signals. The optical wiring layer includes optical wiring lines that are formed over the electrical wiring layer and are designed for propagating optical signals. The electrical element is formed on the electrical wiring layer and is electrically connected to the electrical wiring lines. The optical element is formed on the optical wiring layer and is optically connected to the optical wiring lines.
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公开(公告)号：US20220357629A1
公开(公告)日：2022-11-10
申请号：US17772891
申请日：2019-10-29
发明人： Hiromasa Tanobe , Josuke Ozaki
摘要： An optical module includes: a Peltier module; an optical semiconductor element mounted on the Peltier module; and a driver that drives high-frequency lines of the optical semiconductor element. The optical semiconductor element includes: optical circuits providing a function of an optical interferometer and the high-frequency lines. Cooling performance of the Peltier module in a region in vicinity of the driver is higher than the cooling performance in other regions.
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公开(公告)号：US11300850B2
公开(公告)日：2022-04-12
申请号：US17047984
申请日：2019-04-11
发明人： Josuke Ozaki , Shigeru Kanazawa , Hiromasa Tanobe
摘要： A second substrate is formed on a first substrate. The second substrate includes a Mach-Zehnder modulation unit and a coplanar line. Further, the second substrate is formed on and bonded to the first substrate via an adhesive layer made of a non-conductive adhesive. The Mach-Zehnder modulation unit has an optical modulation region by an electro-optic effect. The coplanar line transmits a modulated signal to the optical modulation region.
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公开(公告)号：US20210341812A1
公开(公告)日：2021-11-04
申请号：US17276656
申请日：2019-09-11
摘要： In a terminator, a midpoint electrode is provided between a first signal electrode and a second signal electrode, a first resistor is connected between the first signal electrode and the midpoint electrode, a second resistor is connected between the second signal electrode and the midpoint electrode, a first GND electrode is provided on a side opposite to the side where the first resistor is provided with the first signal electrode interposed therebetween, a second GND electrode is provided on the side opposite to the side where the second resistor is provided with the second signal electrode interposed therebetween, and capacitances in the terminator are formed between the first signal electrode and the midpoint electrode, between the second signal electrode and the midpoint electrode, between the first signal electrode and the first GND electrode, and between the second signal electrode and the second GND electrode.
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7.发明申请LIGHT MERGING/BRANCHING DEVICE, BIDIRECTIONAL LIGHT PROPAGATION DEVICE, AND LIGHT TRANSMISSION/RECEPTION SYSTEM 有权轻型整合/分配装置，双向光传播装置和光传输/接收系统公开(公告)号：US20140186040A1
公开(公告)日：2014-07-03
申请号：US14240582
申请日：2012-09-27
发明人： Masamichi Fujiwara , Kenichi Suzuki , Naoto Yoshimoto , Manabu Oguma , Toshio Watanabe , Hiroshi Takahashi , Hiromasa Tanobe , Tsutomu Kitoh
IPC分类号： H04B10/27
CPC分类号： H04B10/27 , G02B6/02047 , G02B6/0283 , G02B6/03633 , G02B6/12007 , G02B6/125 , G02B6/14 , G02B6/2808 , G02B6/2813 , G02B6/2821 , G02B6/30 , G02B6/4215 , G02B2006/12109 , H04B10/272 , H04J14/0242 , H04J14/0245 , H04J14/0249
摘要： The present invention relates to an optical coupling/splitting device that realizes the splitting of a down-signal and the coupling of up-signals by the same optical device, and reduces coupling losses of the up-signal. An optical coupling/splitting device in the present invention comprises an optical coupling/splitting means for coupling a plurality of up-signals in a multi-mode for output and splitting a down-signal in a single mode for output, and a two-way optical propagation means for propagating the up-signal that is output from the optical coupling/splitting means in a multi-mode for output and propagate the down-signal in a single mode to be output to the optical coupling/splitting means.
摘要翻译： 光耦合/分离装置技术领域本发明涉及一种光耦合/分离装置，其实现了下信号的分离以及相同光学装置的上行信号的耦合，并且减小了上行信号的耦合损耗。 本发明的光耦合/分离装置包括一个光耦合/分离装置，用于以多模式耦合多个向上信号以输出和分离单模中的降信号以便输出，以及双向 光传播装置，用于以多模式传播从光耦合/分离装置输出的上行信号以便输出，并在单模中传播下信号以输出到光耦合/分离装置。
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公开(公告)号：US20240275014A1
公开(公告)日：2024-08-15
申请号：US18691845
申请日：2021-09-29
发明人： Hiromasa Tanobe
摘要： A high-frequency line connecting structure includes microstrip lines, and a connecting part which bends an extension direction of the line at a place where the microstrip lines are connected. Spaces from which the substrate is removed are formed on the inner peripheral side and the outer peripheral side of the connecting part. The total volume of the space on the inner peripheral side is smaller than the total volume of the space on the outer peripheral side.
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9.发明申请公开(公告)号：US20220399624A1
公开(公告)日：2022-12-15
申请号：US17775517
申请日：2019-11-13
发明人： Hiromasa Tanobe , Josuke Ozaki
摘要： A high-frequency line structure includes: a high-frequency line substrate; ground lead pins fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins are arranged between the ground lead pins, the signal lead pins have a structure in which each of the signal lead pins springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins pertains, and spring-up heights in the structure in which the respective signal lead pins spring up are substantially the same.
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公开(公告)号：US20220384928A1
公开(公告)日：2022-12-01
申请号：US17772446
申请日：2019-10-29
发明人： Hiromasa Tanobe , Josuke Ozaki
摘要： A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.
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