公开(公告)号：US20210198526A1

公开(公告)日：2021-07-01

申请号：US16326427

申请日：2017-05-18

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC: C09J7/22 ,  H01L21/683 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  C09J9/02 ,  C09J11/04 ,  C09J7/38

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and a component migration prevention layer.

公开(公告)号：US20200048504A1

公开(公告)日：2020-02-13

申请号：US16498991

申请日：2018-01-30

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Satoshi Honda ,  Mayu Shimoda

IPC: C09J7/38 ,  C09J7/20 ,  C09J169/00 ,  C09J9/02 ,  H01L21/683 ,  H01L23/00

Abstract: Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70° C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70° C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape.

公开(公告)号：US11786966B2

公开(公告)日：2023-10-17

申请号：US16322086

申请日：2017-05-18

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC: B32B27/36 ,  B32B27/08 ,  C09J7/22 ,  B32B7/12 ,  C09J133/06 ,  C09J7/30 ,  B22F3/02 ,  H01L21/52 ,  C23C28/04 ,  C23C28/00 ,  C09J11/04 ,  C09J9/02 ,  C08F220/18 ,  C09J7/10 ,  H01L21/304 ,  H01L21/683

CPC classification number: B22F3/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/365 ,  C08F220/1808 ,  C09J7/10 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J133/066 ,  C23C28/00 ,  C23C28/04 ,  C23C28/30 ,  C23C28/34 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  C08K2201/001 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2301/41 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  C08F220/1808 ,  C08F220/20

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.

公开(公告)号：US11352527B2

公开(公告)日：2022-06-07

申请号：US16763298

申请日：2018-08-31

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki Ichikawa ,  Yuki Sugo ,  Mayu Shimoda ,  Ryota Mita

IPC: C09J9/02 ,  C09J11/04 ,  C09J7/35

Abstract: The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

公开(公告)号：US20190184460A1

公开(公告)日：2019-06-20

申请号：US16322086

申请日：2017-05-18

Applicant: NITTO DENKO CORPORATION

Inventor： Satoshi Honda ,  Yuki Sugo ,  Mayu Shimoda

IPC: B22F3/02 ,  H01L21/52 ,  H01L21/683 ,  H01L21/304 ,  C09J7/10

CPC classification number: B22F3/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B27/365 ,  C08F220/18 ,  C08K2201/001 ,  C09J7/10 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J133/066 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C23C28/00 ,  C23C28/04 ,  C23C28/30 ,  C23C28/34 ,  H01L21/3043 ,  H01L21/52 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08F2220/1858 ,  C08F220/20

Abstract: A sheet for heat bonding, having a pre-sintering layer that becomes a sintered layer by being heated, and an adhesion layer.