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    Method of producing a wired circuit board
    1.
    发明授权
    Method of producing a wired circuit board 有权
    生产有线电路板的方法

    公开(公告)号：US09167693B2

    公开(公告)日：2015-10-20

    申请号：US14086445

    申请日：2013-11-21

    Applicant: NITTO DENKO CORPORATION

    Inventor： Tomoaki Okuno ,  Saori Kanezaki ,  Tsuyoshi Oguro ,  Takeshi Kawakami

    IPC: H05K3/02 ,  H05K1/11 ,  H05K1/05 ,  G11B5/48

    CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0281 ,  H05K1/05 ,  H05K1/056 ,  H05K1/09 ,  H05K1/117 ,  H05K2201/0154 ,  H05K2201/0394 ,  Y10T29/49155

    Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

    Abstract translation: 制造布线电路基板的方法包括：制备金属支撑层的第一步骤，在金属支撑层的厚度方向的一侧上形成具有第一开口的绝缘层和多个第一开口的第二步骤 的第三步骤，在所述绝缘层的厚度方向的一侧形成具有多个端子部分的导电层，所述多个端子部分对应于所述多个端子形成部分，第四步骤，部分地去除所述金属 支撑层以形成第二开口和设置在所述多个端子形成部之间的至少一个加强金属支撑部，以及第五步骤，去除从所述第二开口露出的所述多个端子形成部，以暴露所述多个端子形成部的两个侧表面 端子部分在厚度方向上。

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