公开(公告)号：US20130185934A1

公开(公告)日：2013-07-25

申请号：US13739395

申请日：2013-01-11

申请人： NITTO DENKO CORPORATION

发明人： Eiji TOYODA ,  Yusaku SHIMIZU ,  Takeshi MATSUMURA

IPC分类号： H05K3/28 ,  H05K13/00

CPC分类号： H05K3/284 ,  C08G59/621 ,  C08L63/00 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K13/00 ,  Y10T29/49146 ,  H01L2924/00

摘要： A resin composition sheet for encapsulating electronic parts and a method of producing an electronic part apparatus using the sheet are provided. The method includes: loading, on a substrate, a resin composition sheet for encapsulating electronic parts including a thermosetting resin composition containing an epoxy resin, a phenol resin, an inorganic filler, and a curing accelerator, having a lowest viscosity in a specific range, and a thickness in a specific range; heating the substrate in a chamber in a decompressed state to sag an end portion of the sheet until it is in contact with a surface of the substrate; and releasing a pressure in the chamber to cause the sheet to adhere onto the substrate due to a difference between a pressure in the space between the sheet and the substrate, and the pressure in the chamber after the release, followed by thermal curing.

摘要翻译： 提供了一种用于封装电子部件的树脂组合物片材和使用该片材的电子部件装置的制造方法。 该方法包括：在基材上装载包含含有特定范围内最低粘度的环氧树脂，酚醛树脂，无机填料和固化促进剂的热固性树脂组合物的电子部件用树脂组合物片， 厚度在特定范围内; 在处于减压状态的腔室中加热衬底以使片材的端部下垂，直到其与衬底的表面接触; 并且释放室内的压力，由于片材与基板之间的间隔的压力和释放后的室内的压力之间的差异，随后进行热固化，使片材粘附到基板上。

公开(公告)号：US20130183469A1

公开(公告)日：2013-07-18

申请号：US13740757

申请日：2013-01-14

申请人： Nitto Denko Corporation

发明人： Yusaku SHIMIZU ,  Eiji TOYODA ,  Takeshi MATSUMURA

IPC分类号： B32B1/02 ,  B32B3/30

CPC分类号： B32B1/02 ,  B32B3/30 ,  B32B27/20 ,  B32B27/26 ,  B32B27/302 ,  B32B27/38 ,  B32B2270/00 ,  B32B2457/00 ,  B81C1/00269 ,  B81C2203/0118 ,  Y10T156/1052 ,  Y10T428/1397

摘要： A resin sheet is provided for hollow encapsulation excellent in productivity, and excellent in resin strength and heat resistance as well. The resin sheet for hollow encapsulation to be used for subjecting electronic parts mounted on an aggregate substrate to hollow encapsulation includes an epoxy resin composition containing the following components (A) to (D), in which the resin sheet for hollow encapsulation has, in one surface of a sheet main body, a plurality of cavities for storing the electronic parts to subject the parts to hollow encapsulation: (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; and (D) a curing accelerator.

摘要翻译： 树脂片材的生产率优异，树脂强度和耐热性也优异。 用于将安装在集合基板上的电子部件用于中空封装的中空封装用树脂片材包括含有以下成分（A）〜（D）的环氧树脂组合物，其中中空封装用树脂片材 片状主体的表面，多个空腔，用于存放电子部件以使部件承受中空封装：（A）环氧树脂; （B）固化剂; （C）无机填料; 和（D）固化促进剂。

公开(公告)号：US20160060450A1

公开(公告)日：2016-03-03

申请号：US14779859

申请日：2014-03-17

申请人： NITTO DENKO CORPORATION

发明人： Eiji Toyoda ,  Yusaku SHIMIZU ,  Jun ISHII

IPC分类号： C08L65/02 ,  H03H9/64

摘要： Provided are a sealing sheet having excellent flexibility and capable of producing an electronic component package which is highly reliable even if an object to be sealed has a hollow structure, a method for manufacturing the sealing sheet, and a method for manufacturing the electronic component package. The present invention is a sealing sheet containing dispersed domains of an elastomer, the domains having a maximum diameter of 20 μm or less.

摘要翻译： 提供一种具有优异的柔性并能够制造即使被密封物体具有中空结构也是高可靠性的电子部件封装的密封片，密封片的制造方法和电子部件封装的制造方法。 本发明是一种包含弹性体的分散畴的密封片，该畴的最大直径为20μm以下。