公开(公告)号：US09425110B1

公开(公告)日：2016-08-23

申请号：US14837718

申请日：2015-08-27

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Jose G. Padilla ,  Philip W. Hon ,  Shih-En Shih ,  Roger S. Tsai ,  Xianglin Zeng

IPC: H01L21/66 ,  H01L21/768 ,  H01L25/065 ,  H01L25/00 ,  H01L23/66

CPC classification number: H01L22/22 ,  H01L22/14 ,  H01L22/32 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6683 ,  H01L2225/06555 ,  H01L2225/06596

Abstract: A three-dimensional wafer level packaged (WLP) integrated circuit that includes a pair of opposing circuit cells fabricated on separate wafers that have been bonded together to provide vertical circuit redundancy. The integrated circuits on each of the separate wafers are performance tested prior to the wafers being bonded together so as to designate good performing circuits as active circuit cells and poor performing circuits as inactive circuit cells. The inactive circuit cell for a particular pair of integrated circuits is metalized with a short circuiting metal layer to make it inoperable. The WLP integrated circuit implements a yield-enhancing circuit redundancy scheme on spatially uncorrelated wafers that avoids wasting valuable wafer x-y planar area, which provides cost savings as a result of more wafer area being available for distinct circuits on each wafer rather than sacrificed for traditional side-by-side redundant copies of circuits.

Abstract translation: 三维晶片级封装（WLP）集成电路，其包括一对相对的电路单元，其在单独的晶片上制造，所述相对电路单元已经被结合在一起以提供垂直电路冗余。 每个单独的晶片之间的集成电路在晶片被接合在一起之前进行性能测试，以便将表现良好的电路指定为有源电路单元，并且作为不活动电路单元的执行不良电路。 用于特定对集成电路的非活动电路单元用短路金属层进行金属化，以使其不可操作。 WLP集成电路在空间不相关的晶片上实现了屈服增强电路冗余方案，避免了浪费有价值的晶圆xy平面区域，由于更多的晶片面积可用于每个晶片上的不同电路，因此可以节省成本，而不是牺牲传统方面 - 电路的冗余副本。

公开(公告)号：US09425511B1

公开(公告)日：2016-08-23

申请号：US14660693

申请日：2015-03-17

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Gregory P. Krishmar-Junker ,  Philip W. Hon ,  Arun K. Bhattacharyya

IPC: H01Q13/00 ,  H01Q13/24 ,  H01Q13/02 ,  H01Q1/48 ,  H01Q1/50

CPC classification number: H01Q13/02 ,  H01Q1/48 ,  H01Q13/08 ,  H01Q13/24 ,  H01Q19/08

Abstract: A coaxial feed horn including a dielectric substrate having at least one microstrip feed line deposited on a bottom surface of the substrate and a ground plane deposited on a top surface of the substrate. A cylindrical outer conductor is electrically coupled to the ground plane and an embedded conductor is coaxially positioned within the outer conductor, where the embedded conductor is in electrical contact with the microstrip line. A dielectric member is positioned within the outer conductor and includes a tapered portion extending out of the outer conductor at the aperture. In one embodiment, the dielectric member is a plurality of dielectric layers each having a different dielectric constant, where a first dielectric layer allows for propagation of a TE11 sum mode and a last dielectric layer is positioned proximate the antenna aperture and allows for propagation of a TE12 difference mode.

Abstract translation: 一种同轴馈电喇叭，包括具有沉积在基板的底表面上的至少一个微带馈电线的电介质基板和沉积在基板顶表面上的接地平面。 圆柱形外部导体电耦合到接地平面，并且嵌入式导体同轴地位于外部导体内，其中嵌入式导体与微带线电接触。 电介质构件定位在外导体内，并且包括在孔处从外导体延伸出的锥形部分。 在一个实施例中，电介质构件是各自具有不同介电常数的多个电介质层，其中第一电介质层允许传播TE11和方式，并且最后的电介质层位于天线孔附近，并且允许 TE12差分模式。

公开(公告)号：US09431715B1

公开(公告)日：2016-08-30

申请号：US14818122

申请日：2015-08-04

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Arun K. Bhattacharyya ,  Gregory P. Krishmar-Junker ,  Philip W. Hon ,  Shih-en Shih ,  David I. Stones ,  Dah-Weih Duan ,  Loc Chau

IPC: H01Q13/00 ,  H01Q13/02 ,  H01Q1/48

CPC classification number: H01Q13/02 ,  H01Q1/48 ,  H01Q13/025

Abstract: A flared feed horn including a plurality of signal lines deposited on a bottom surface of a substrate and forming part of a TE11 sum mode launcher, a ground plane deposited a top surface of the substrate, and an outer conductor electrically coupled to the ground plane and having an internal chamber, where the conductor includes a flared portion and a cylindrical portion. The outer conductor includes an opening opposite to the substrate defining an aperture of the feed horn. The feed horn also includes an embedded conductor positioned within the chamber and being coaxial with the outer conductor, where the embedded conductor is in electrical contact with the plurality of signal lines. The feed horn also includes a TE12 difference mode launcher electrically coupled to the outer conductor proximate the aperture.

Abstract translation: 一种扩口式馈电喇叭，包括沉积在基板的底表面上并形成TE11和模式发射器的一部分的多条信号线，沉积基板的顶表面的接地平面和电耦合到接地平面的外导体， 具有内部腔室，其中导体包括扩口部分和圆柱形部分。 外部导体包括与衬底相对的开口，该开口限定馈电喇叭的孔。 馈电喇叭还包括位于室内并与外部导体同轴的嵌入式导体，其中嵌入式导体与多条信号线电接触。 馈电喇叭还包括电耦合到靠近孔径的外导体的TE12差分模式发射器。