MANUFACTURING ETHYLENE INTERPOLYMER PRODUCTS AT HIGHER PRODUCTION RATE

    公开(公告)号:US20190135959A1

    公开(公告)日:2019-05-09

    申请号:US15805287

    申请日:2017-11-07

    IPC分类号: C08F210/16 C08J5/18

    摘要: This disclosure relates to an improved continuous solution polymerization process wherein production rate is increased. Process solvent, ethylene, optional comonomers, optional hydrogen and a bridged metallocene catalyst formulation are injected into a first reactor to form a first ethylene interpolymer. Optionally, process solvent, ethylene, optional comonomers, optional hydrogen and a bridged metallocene catalyst formulation are injected into a second reactor forming a second ethylene interpolymer. The first and second reactors may be configured in series or parallel modes of operation. Optionally, a third ethylene interpolymer is formed in a third reactor, wherein a homogeneous catalyst formulation or a heterogeneous catalyst formulation is employed. In solution, the first, optional second and optional third ethylene interpolymers are combined, the catalyst is deactivated, the solution is optionally passivated and following a phase separation process an ethylene interpolymer product is recovered.

    Ethylene copolymers produced with single site catalyst

    公开(公告)号:US10239976B2

    公开(公告)日:2019-03-26

    申请号:US15504341

    申请日:2015-08-06

    摘要: Embodiments of the invention described herein relate to a polyethylene polymer composition suitable for use in the manufacture of packaging articles, flexible films and/or sheets. In one embodiment, the copolymer comprises a polyethylene resin with density 0.918 g/cm3 to about 0.935 g/cm3, G′ at G″(500 Pa) value, as determined from Dynamic Mechanical Analysis at 190° C., of less than 40 Pa, Mz/Mw of greater than 2, CDBI50 of greater than 60. Other embodiments relate to polymer compositions with defined molecular characteristics and formulations suitable for use in the manufacture of articles including films, sheets, bags and pouches with improved creep resistance and high toughness and a good balance of film stiffness and processability in monolayer and/or multi-layer film structures.