公开(公告)号：US20140281652A1

公开(公告)日：2014-09-18

申请号：US13831063

申请日：2013-03-14

Applicant: NVIDIA CORPORATION

Inventor： Tukaram Shankar Methar ,  Nilesh Acharya ,  Jyotirmaya Swain ,  Brian Lawrence Smith

IPC: H03L7/00 ,  G06F1/12

CPC classification number: H03L7/00 ,  G06F1/12

Abstract: A system and apparatus that include a selectable synchronizer circuit for synchronizing data across asynchronous boundaries are disclosed. The apparatus includes a unit associated with a first clock domain and a synchronizer sub-unit (SSU) coupled to the unit and associated with a second clock domain. The synchronizer sub-unit includes two or more synchronizers and selector logic configured to select one output of the two or more synchronizers.

Abstract translation: 公开了一种包括用于跨异步边界同步数据的可选同步电路的系统和装置。 该设备包括与第一时钟域相关联的单元和耦合到该单元并与第二时钟域相关联的同步器子单元（SSU）。 同步器子单元包括两个或多个同步器和选择器逻辑，其被配置为选择两个或多个同步器的一个输出。

公开(公告)号：US20220026967A1

公开(公告)日：2022-01-27

申请号：US16934395

申请日：2020-07-21

Applicant: NVIDIA Corporation

Inventor： Jun Gu ,  Tao Li ,  Chad Plummer ,  Brian Lawrence Smith

IPC: G06F1/20

Abstract: Integrated circuits (ICs)—depending on a current workload—may exceed thermal cooling budgets. As a result, ICs often implement thermal sensors to measure temperatures at junctions or hot spots along the IC. Due to a distance between the thermal sensors and the various junctions, a thermal offset may be added to the temperature readings from the thermal sensors to more accurately estimate the temperature at the junctions. To account for different workload distributions—e.g., asymmetric or symmetric—the systems and methods described herein may dynamically adjust the thermal offsets. As a result, the efficiency of the IC may be increased as thermal settings for the IC may take into account the ability of the thermal cooling budget to effectively cool the IC under a current operating condition—thereby reducing premature throttling back or shutting down of power to the IC.

公开(公告)号：US20210294791A1

公开(公告)日：2021-09-23

申请号：US16826005

申请日：2020-03-20

Applicant: NVIDIA Corporation

Inventor： Sreedhar Narayanaswamy ,  Shantanu K. Sarangi ,  Hemalkumar Chandrakant Doshi ,  Hari Unni Krishnan ,  Gunaseelan Ponnuvel ,  Brian Lawrence Smith

IPC: G06F16/23

Abstract: Latency of in-system test (IST) execution for a hardware component of an in-field (deployed) computing platform may be reduced when a value of a physical operating parameter can be changed without rebooting the computing platform. A test (e.g., patterns or vectors) is executed for varying values of the physical operating parameter (e.g., supply voltage, clock speed, temperature, noise magnitude/duration, operating current, and the like), providing the ability to detect faults in the hardware components.

公开(公告)号：US11494370B2

公开(公告)日：2022-11-08

申请号：US16826005

申请日：2020-03-20

Applicant: NVIDIA Corporation

Inventor： Sreedhar Narayanaswamy ,  Shantanu K. Sarangi ,  Hemalkumar Chandrakant Doshi ,  Hari Unni Krishnan ,  Gunaseelan Ponnuvel ,  Brian Lawrence Smith

IPC: G06F16/23 ,  G06F11/27 ,  G06F11/273

Abstract: Latency of in-system test (IST) execution for a hardware component of an in-field (deployed) computing platform may be reduced when a value of a physical operating parameter can be changed without rebooting the computing platform. A test (e.g., patterns or vectors) is executed for varying values of the physical operating parameter (e.g., supply voltage, clock speed, temperature, noise magnitude/duration, operating current, and the like), providing the ability to detect faults in the hardware components.

公开(公告)号：US11231760B1

公开(公告)日：2022-01-25

申请号：US16934395

申请日：2020-07-21

Applicant: NVIDIA Corporation

Inventor： Jun Gu ,  Tao Li ,  Chad Plummer ,  Brian Lawrence Smith

IPC: G06F1/20

Abstract: Integrated circuits (ICs)—depending on a current workload—may exceed thermal cooling budgets. As a result, ICs often implement thermal sensors to measure temperatures at junctions or hot spots along the IC. Due to a distance between the thermal sensors and the various junctions, a thermal offset may be added to the temperature readings from the thermal sensors to more accurately estimate the temperature at the junctions. To account for different workload distributions—e.g., asymmetric or symmetric—the systems and methods described herein may dynamically adjust the thermal offsets. As a result, the efficiency of the IC may be increased as thermal settings for the IC may take into account the ability of the thermal cooling budget to effectively cool the IC under a current operating condition—thereby reducing premature throttling back or shutting down of power to the IC.