公开(公告)号：US20180233465A1

公开(公告)日：2018-08-16

申请号：US15871440

申请日：2018-01-15

Applicant: NXP B.V.

Inventor： Maristella SPELLA ,  Waqas Hassan SYED ,  Daniele CAVALLO ,  Mingda HUANG ,  Leo VAN GEMERT

IPC: H01L23/66 ,  H01Q19/10 ,  H01L23/528 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/528 ,  H01L24/16 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/30105 ,  H01Q1/2283 ,  H01Q1/40 ,  H01Q13/16 ,  H01Q15/10 ,  H01Q19/09 ,  H01Q19/10 ,  H01Q19/28 ,  H01Q21/064

Abstract: An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.