Control over ammonium fluoride levels in oxide etchant
    1.
    发明授权
    Control over ammonium fluoride levels in oxide etchant 有权
    控制氧化物腐蚀剂中的氟化铵水平

    公开(公告)号:US08932874B2

    公开(公告)日:2015-01-13

    申请号:US14322009

    申请日:2014-07-02

    申请人: Nalco Company

    摘要: The invention is directed towards methods and compositions for identifying the amount of ammonium acid in a buffered oxide etching composition. In buffered oxide etching compositions it is very difficult to measure the amount of ammonium acid because it has varying equilibriums and it is toxic so it hard to handle and sample. When used to manufacture microchips however, incorrect amounts of ammonium acid will ruin those chips. The invention utilizes a unique method of spectrographically measuring the ammonium acid when in contact with added chromogenic agents to obtain exact measurements that are accurate, immediate, and safe.

    摘要翻译: 本发明涉及用于鉴定缓冲氧化物蚀刻组合物中的铵酸的量的方法和组合物。 在缓冲氧化物蚀刻组合物中,非常难以测量铵酸的量,因为其具有不同的平衡,并且它是有毒的,因此难以处理和取样。 然而,当用于制造微芯片时,不正确量的铵酸将破坏这些芯片。 本发明利用与添加的显色剂接触时光谱测量铵酸的独特方法,以获得准确,立即和安全的精确测量。

    Control over hydrogen fluoride levels in oxide etchant
    3.
    发明授权
    Control over hydrogen fluoride levels in oxide etchant 有权
    控制氧化物腐蚀剂中的氟化氢水平

    公开(公告)号:US08945939B2

    公开(公告)日:2015-02-03

    申请号:US14082448

    申请日:2013-11-18

    申请人: Nalco Company

    IPC分类号: G01N21/75

    摘要: The invention is directed towards methods and compositions for identifying the amount of hydrofluoric acid in a buffered oxide etching composition. In buffered oxide etching compositions it is very difficult to measure the amount of hydrofluoric acid because it has varying equilibriums and it is toxic so it hard to handle and sample. When used to manufacture microchips however, incorrect amounts of hydrofluoric acid will ruin those chips. The invention utilizes a unique method of spectrographically measuring the hydrofluoric acid when in contact with added chromogenic agents to obtain exact measurements that are accurate, immediate, and safe.

    摘要翻译: 本发明涉及用于鉴定缓冲氧化物蚀刻组合物中氢氟酸的量的方法和组合物。 在缓冲氧化物蚀刻组合物中,非常难以测量氢氟酸的量,因为其具有不同的平衡,并且它是有毒的,因此难以处理和取样。 然而,当用于制造微芯片时,不正确量的氢氟酸会破坏这些芯片。 当与添加的显色剂接触时,本发明利用光谱测量氢氟酸的独特方法,以获得准确,立即和安全的精确测量。

    CONTROL OVER HYDROGEN FLUORIDE LEVELS IN OXIDE ETCHANT
    4.
    发明申请
    CONTROL OVER HYDROGEN FLUORIDE LEVELS IN OXIDE ETCHANT 有权
    控制氧化物中氢氟化物的含量

    公开(公告)号:US20140315320A1

    公开(公告)日:2014-10-23

    申请号:US14322009

    申请日:2014-07-02

    申请人: Nalco Company

    IPC分类号: G01N31/22

    摘要: The invention is directed towards methods and compositions for identifying the amount of hydrofluoric acid in a buffered oxide etching composition. In buffered oxide etching compositions it is very difficult to measure the amount of hydrofluoric acid because it has varying equilibriums and it is toxic so it hard to handle and sample. When used to manufacture microchips however, incorrect amounts of hydrofluoric acid will ruin those chips. The invention utilizes a unique method of spectrographically measuring the hydrofluoric acid when in contact with added chromogenic agents to obtain exact measurements that are accurate, immediate, and safe.

    摘要翻译: 本发明涉及用于鉴定缓冲氧化物蚀刻组合物中氢氟酸的量的方法和组合物。 在缓冲氧化物蚀刻组合物中,非常难以测量氢氟酸的量,因为其具有不同的平衡,并且它是有毒的,因此难以处理和取样。 然而,当用于制造微芯片时,不正确量的氢氟酸会破坏这些芯片。 当与添加的显色剂接触时,本发明利用光谱测量氢氟酸的独特方法,以获得准确,立即和安全的精确测量。