摘要:
An Nb.sub.3 Al multi-filamentary superconducting wire capable of realizing both stabilization of a superconducting state and increase in capacity is provided. The Nb.sub.3 Al multi-filamentary superconducting wire includes a core formed of copper or copper alloy and located at the center of the wire; a multi-filamentary superconductor layer located around the core and having filaments containing Nb and Al as constituent elements embedded in a matrix formed of copper or copper alloy; and a high resistance layer located around the multi-filamentary superconductor layer, and is characterized in that a sectional area of the core is at least 15% of the total sectional area of the core and the matrix and that the core and the matrix are formed of copper or copper alloy of at least 99.9% purity.
摘要:
In order to provide a superconducting wire that has a high critical current value, has no defects such as bulges, and has high mechanical strength, an oxide superconducting material (1) is covered, and ceramic particles or fibers (3) are buried in the surface of a covering (2) made of metal
摘要:
Powder including at least a superconducting phase is degassed (step S1). After the powder is filled in a silver pipe (step S2), the silver pipe is degassed at a high temperature (step S3). After a plurality of single-core wires are inserted into another silver pipe to attain a multi-core structure, the silver pipe is degassed at a high temperature (step S5). The silver pipe is sealed under a reduced pressure (step S6). Therefore, even when a multi-core superconducting wire is manufactured, a manufacturing method of a superconducting wire capable of preventing swelling of the wire caused by a residual gaseous component can be obtained.
摘要:
Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire. Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
摘要:
Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
摘要:
Methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
摘要:
A heating and cooling module wherein the calorific value can be increased in a heater for mounting and heating a semiconductor chip, and the heating and cooling module is not damaged when the semiconductor chip is rapidly heated and cooled. The heating and cooling module of the includes a ceramic heater for mounting and heating a treated object, a cooling mechanism for cooling the ceramic heater, and a holder between the ceramic heater and the cooling mechanism, wherein the ceramic heater is an aluminum nitride heater having one or more internally disposed heating element layers. An intermediate layer is preferably inserted between the ceramic heater and the holder. An intermediate layer is also preferably inserted between the holder and the cooling mechanism.
摘要:
A heater unit that much improves accuracy in thermal uniformity of an object of heating during cooling, particularly rapid cooling, is provided. The heater unit in accordance with the present invention includes a heater substrate for mounting an object of heating and performing heat treatment thereon, and a cooling module for cooling the heater substrate, and between said heater substrate and the cooling module, an intervening body is arranged. Utilizing deformability of the intervening body, ratio of a non-contact portion can be reduced than when the intervening body is not provided, and temperature uniformity of the heater substrate at the time of cooling can be improved.
摘要:
A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.
摘要:
A semiconductor heater holder for setting a heater for heating a semiconductor, having an opening, wherein the heat capacity of the semiconductor heater holder is not more than 1.5 times the heat capacity of the heater, and a semiconductor manufacturing apparatus comprising this semiconductor heater holder.