摘要:
When polycrystalline silicon germanium film is used for gate electrodes in a MOS transistor apparatus, there have been problems of reduced reliability in the gate insulating film, due to stress in the silicon germanium grains. Therefore, a polysilicon germanium film is formed, after forming silicon fine particles of particle size 10 nm or less on an oxide film. As a result, it is possible to achieve a high-speed MOS transistor apparatus using an ultra-thin oxide film having a film thickness of 1.5 nm or less, wherein the Ge concentration of the polycrystalline silicon germanium at its interface with the oxide film is uniform, thereby reducing the stress in the film, and improving the reliability of the gate electrode.
摘要:
When polycrystalline silicon germanium film is used for gate electrodes in a MOS transistor apparatus, there have been problems of reduced reliability in the gate insulating film, due to stress in the silicon germanium grains. Therefore, a polysilicon germanium film is formed, after forming silicon fine particles of particle size 10 nm or less on an oxide film. As a result, it is possible to achieve a high-speed MOS transistor apparatus using an ultra-thin oxide film having a film thickness of 1.5 nm or less, wherein the Ge concentration of the polycrystalline silicon germanium at its interface with the oxide film is uniform, thereby reducing the stress in the film, and improving the reliability of the gate electrode.
摘要:
An oily dispersion of an inorganic microparticle oxide powder that exhibits excellent texture has superior compatibility with other cosmetic material components. The oily dispersion contains only two components of a dispersion medium and a surface-treated inorganic microparticle oxide powder, wherein the dispersion medium is an oil, the surface-treated inorganic microparticle oxide powder is a powder surface-treated with branched fatty acid containing isostearic acid as a primary constituent component or a metal salt containing isostearic acid as a primary constituent component at an amount of 1 to 30% by weight with respect to the powder as a base material, and the surface-treated inorganic microparticle oxide powder has a solid concentration of 25% by weight or more and a viscosity of 2,000 mPa·s or less at 25° C. in the preparation of the oily dispersion.
摘要:
A curable resin composition layer (3) containing an insulating resin and a curing agent is formed on the surface of an inner layer board having an electrical insulating layer (1) with a conductor circuit (2) formed on the surface, so as to cover said conductor circuit. A compound (4) having a structure capable of coordinating to metal atoms or metal ions is brought into contact with the surface of the curable resin composition layer. An electrical insulating layer (7) is formed by curing the curable resin composition layer. A metallic thin film layer (8) is formed on the surface of the electrical insulating layer. A conductor circuit (9) is formed on the surface of the electrical insulating layer utilizing the metallic thin film layer. A multilayer circuit board is manufactured through these steps.
摘要:
Disclosed is a method of producing an optically active &bgr;-hydroxy sulfonic acid compound comprising hydrogenating a &bgr;-keto sulfonic acid compound represented by formula 1: where R1 represents an alkyl or a phenyl group, which may be substituted, and R2 represents sodium or an alkyl group, in an acidic solvent, in the presence of an asymmetric catalyst comprising a complex of bivalent Ru, having 2,2′-bis(diphenylphosphino)-1,1′-binaphthyl as a ligand, to produce a compound represented by formula 2: where R1 and R2 are as defined above, and * designates an asymmetric carbon atom.
摘要:
Bit lines BL of a DRAM that are narrowed to 0.1 &mgr;m or less are made of two-layered conductive films, in which a W (tungsten) film is deposited on a WN (tungsten nitride) film. For bit lines BL, fewer W atoms diffuse across the interface between the W film and the WN film, within crystal grains, and at grain boundaries of the W film, and no tensile stress exists in the W film. Therefore, high-temperature thermal processing in the capacitor formation process does not cause wiring breaks even when the width of the bit lines BL is narrowed to 0.1 &mgr;m or less.