Dielectric film and method of fabricating the same
    1.
    发明授权
    Dielectric film and method of fabricating the same 有权
    电介质膜及其制造方法

    公开(公告)号:US06624462B1

    公开(公告)日:2003-09-23

    申请号:US09640520

    申请日:2000-08-17

    IPC分类号: H01L21331

    摘要: A Pt/Ti film is formed on a substrate, and the Pt/Ti film is patterned in to a bottom electrode. Subsequently, a SrTiO3film, that is, a dielectric film, is formed on the substrate by sputtering using a mixture of an Ar gas, an O2 gas and a N2 gas as a film forming gas. The SrTiO3 film is patterned into a capacitor dielectric film formed on the bottom electrode. A top electrode is then formed on the capacitor dielectric film. Since a N2 gas is used as the film forming gas in addition to an Ar/O2 gas, a SrTiO3 film with a high dielectric constant and small leakage can be formed at a low temperature. By using this SrTiO3 film, a thin film capacitor with high capacitance and good dielectric characteristics can be obtained.

    摘要翻译: 在基板上形成Pt / Ti膜,将Pt / Ti膜图案化成底部电极。 随后,使用Ar气体,O 2气体和N 2气体的混合物作为成膜气体,通过溅射在衬底上形成SrTiO 3膜,即电介质膜。 将SrTiO 3膜图案化成形成在底部电极上的电容器电介质膜。 然后在电容器电介质膜上形成顶部电极。 除了Ar / O 2气体之外,由于使用N 2气体作为成膜气体,所以可以在低温下形成具有高介电常数和小的泄漏的SrTiO 3膜。 通过使用该SrTiO 3膜,可以获得具有高电容和良好介电特性的薄膜电容器。

    Flexible thin film capacitor having an adhesive film
    3.
    发明授权
    Flexible thin film capacitor having an adhesive film 有权
    具有粘合膜的柔性薄膜电容器

    公开(公告)号:US06212057B1

    公开(公告)日:2001-04-03

    申请号:US09471621

    申请日:1999-12-21

    IPC分类号: H01G430

    摘要: According to a flexible thin film capacitor of the present invention, an adhesive film is formed on a substrate composed of at least one selected from the group consisting of an organic polymer and a metal foil, and an inorganic high dielectric film and metal electrode films are formed thereon. A metal oxide adhesive film can be used as the adhesive film. The adhesive film is formed in contact with the inorganic high dielectric film and at least one of the metal electrode films.

    摘要翻译: 根据本发明的柔性薄膜电容器,在由选自有机聚合物和金属箔中的至少一种构成的基板上形成粘合膜,并且无机高介电膜和金属电极膜是 形成在其上。 可以使用金属氧化物粘合膜作为粘合膜。 该粘合膜形成为与无机高介电膜和至少一个金属电极膜接触。