摘要:
Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. The trench completely etches away portions of the substrate near the ink feed holes so that the thin film layers form a shelf in the vicinity of the ink feed holes. In one embodiment, the shelf supports the ink ejection elements. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers.
摘要:
Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers. A phosphosilicate glass (PSG) layer, providing an insulation layer beneath the resistive layers, is etched back from the ink feed holes and is protected by a passivation layer to prevent the ink from interacting with the PSG layer. Other layers may also be protected from the ink by being etched back.
摘要:
Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers. A phosphosilicate glass (PSG) layer, providing an insulation layer beneath the resistive layers, is etched back from the ink feed holes and is protected by a passivation layer to prevent the ink from interacting with the PSG layer. Other layers may also be protected from the ink by being etched back.
摘要:
An inkjet printing device is arranged to employ a first set of multiple nozzle drop generators activated by a first address signal and a second set of multiple nozzle drop generators activated by a second address signal. The multiple nozzles of each drop generator of the first set are arranged in a predetermined geometric pattern, each of which encompasses at least one nozzle of a drop generator of the second set. The ink ejectors of one drop generator of the first drop generator set are arranged in subgroups, one subgroup of which shares a switched power return with one subgroup of ink ejectors of one drop generator of the second drop generator set.
摘要:
An inkjet printing device is arranged to employ a first set of multiple nozzle drop generators activated by a first address signal and a second set of multiple nozzle drop generators activated by a second address signal. The multiple nozzles of each drop generator of the first set are arranged in a predetermined geometric pattern, each of which encompasses at least one nozzle of a drop generator of the second set. The ink ejectors of one drop generator of the first drop generator set are arranged in subgroups, one subgroup of which shares a switched power return with one subgroup of ink ejectors of one drop generator of the second drop generator set.
摘要:
Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. In one embodiment, there are more ink feed holes than ink ejection chambers, so that more than one ink feed hole provides ink to each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers.
摘要:
Methods and systems for forming slotted substrates are described. In one exemplary embodiment, a substrate has a thickness defined by a first surface and a generally opposing second surface. The substrate has a fluid-feed slot extending between the first surface and the second surface with the fluid-feed slot being defined, at least in part, by a central portion and one or more capillary channels in fluid flowing relation to the central portion.
摘要:
In one embodiment, a fluid ejection device comprises a substrate having a fluid slot defined from a first surface through to a second opposite surface; an ejection element formed over the first surface and that ejects fluid therefrom; and a filter having feed holes positioned over the fluid slot near the first surface. Fluid moves from the second surface through the feed holes to the ejection element. In a particular embodiment, the filter is formed of a first material that is surrounded by a second material. In another particular embodiment, the filter is formed from the back side and is formed of the same material as the substrate.
摘要:
A bubble valve that comprises a liquid delivery channel and a localized heating arrangement. The liquid delivery channel includes an upstream portion and a constriction downstream of the upstream portion. The constriction has a smaller cross-sectional area than the upstream portion. The localized heating arrangement is located in the liquid delivery channel and generates heat to nucleate and enlarge a bubble in the liquid. The constriction is shaped to form a seal with the bubble. The localized heating arrangement additionally generates heat to move the bubble relative to the constriction to control the flow of the liquid. A pressure regulator that comprises a liquid delivery channel connected to a liquid outlet, a sensor located adjacent the liquid outlet, a controller that operates in response to the sensor and a localized heating arrangement. The liquid delivery channel includes an upstream portion, and a constriction located between the upstream portion and the liquid outlet. The constriction has a smaller cross-sectional area than the upstream portion. The localized heating arrangement is located in the liquid delivery channel and generates heat in response to the controller to nucleate and enlarge a bubble in the liquid. The constriction is shaped to form a seal with the bubble. The localized heating arrangement additionally generates heat to move the bubble relative to the constriction to control the flow of the liquid to the liquid outlet.
摘要:
Systems, methods, and devices are provided for printhead calibration. A method includes printing a swath. A temperature rise of a printhead is measured during the swath and an operating energy of the printhead is calibrated based on the measured temperature rise while performing a non-test print job.