公开(公告)号：US20150340572A1

公开(公告)日：2015-11-26

申请号：US14745112

申请日：2015-06-19

Applicant: Nichia Corporation

Inventor： Nobuhide KASAE ,  Keisuke SEJIKI

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L33/502 ,  F21V21/00 ,  H01L33/486 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.

Abstract translation: 本发明提供了一种用于发光器件的模制封装，其包括模制树脂和第一和第二引线，所述第一引线的暴露表面具有彼此相对的第一和第二边缘部分，以将其中的安装区域放置在 第一方向，第一边缘部分和第二边缘部分分别具有一个第一切口和第二切口，该安装区域具有不小于第一和第二切口之间的距离的尺寸，并且小于第一边缘部分中的第一边缘部分之间的距离 第一个方向