公开(公告)号：US07375771B2

公开(公告)日：2008-05-20

申请号：US10626846

申请日：2003-07-25

申请人： Nobuaki Naoi ,  Fumio Miyazawa

发明人： Nobuaki Naoi ,  Fumio Miyazawa

IPC分类号： H04N5/50

CPC分类号： H03J1/0075 ,  H03J1/0058 ,  H03J1/0066 ,  H03J7/18 ,  H03J7/183

摘要： When channel setup is carried out under poor receiving condition, the previous channel information that has been stored on a channel map in the channel setup carried out under normal receiving condition is replaced with the later channel information that is stored on the channel map including less acquired channel information formed in the channel setup carried out later. Existence of broadcast signal is judged only on channels other than channels that are registered based on the fact that the channels include a broadcast signal on a channel map stored in the previous channel setup, and the channel information of the broadcast signal detected later is registered additionally on the channel map in a flash memory as the channel including the broadcast signal.

摘要翻译： 当在不良接收条件下执行信道建立时，在正常接收条件下进行的信道建立中存储在信道映射上的先前信道信息被存储在包含较少获取的信道映射的信道映射后面的信道信息所取代 在以后进行的频道设置中形成的频道信息。 广播信号的存在仅基于通过在前一频道建立中存储的频道图上的信道包括广播信号的事实而登记的频道以外的频道进行判断，并且再次登记后述的广播信号的频道信息 在作为包括广播信号的频道的闪存中的频道地图上。

公开(公告)号：US09011212B2

公开(公告)日：2015-04-21

申请号：US14111962

申请日：2012-04-16

申请人： Kouki Itoyama ,  Fumio Miyazawa

发明人： Kouki Itoyama ,  Fumio Miyazawa

IPC分类号： H01L21/304 ,  C08J9/12 ,  C08G18/48 ,  C08G18/10 ,  B24B37/22 ,  B24B37/24 ,  C08G101/00

CPC分类号： H01L21/304 ,  B24B37/22 ,  B24B37/24 ,  C08G18/10 ,  C08G18/4854 ,  C08G2101/0008 ,  C08G2101/0083 ,  C08J9/12 ,  C08J2207/00 ,  C08J2375/04 ,  C08G18/3814 ,  C08G18/48

摘要： Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

摘要翻译： 提供了一种抛光垫，其补救当使用常规的硬（干）抛光垫时发生划痕的问题，其抛光速率和抛光均匀性优异，并且不仅可用于初次抛光，而且可用于精加工抛光，以及 其制造方法。 抛光垫是用于抛光半导体器件的抛光垫，其包括具有聚氨酯 - 聚脲树脂泡沫体的抛光层，其包含基本上为球形的单元，其中所述聚氨酯 - 聚脲树脂泡沫体的杨氏模量E在450至30000kPa的范围内， 密度D在0.30至0.60g / cm 3的范围内。

公开(公告)号：US06280841B1

公开(公告)日：2001-08-28

申请号：US09376011

申请日：1999-08-18

申请人： Fumio Miyazawa ,  Nobuya Morishita ,  Keiko Noda

发明人： Fumio Miyazawa ,  Nobuya Morishita ,  Keiko Noda

IPC分类号： B32B2700

CPC分类号： D06M15/53 ,  B65H55/00 ,  B65H2701/319 ,  D01F6/70 ,  D06M7/00 ,  D06M2101/38 ,  D06M2200/40 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2967 ,  Y10T428/2969

摘要： A package of polyurethane elastic yarn for heat bonding which weighs more than 1 kg and measures such that the diameter-to-width ratio is greater than 0.5 and which is obtained from polyurethane elastic yarn by giving it 3.0-10.0 wt % of a finishing agent and then winding it up, said finishing agent is polypropylene glycol-based polyol used alone or composed of component (A) which is a polypropylene glycol-based polyol and component (B) which is a reaction product of a polypropylene glycol-based polyol and an organic diisocyanate compound. The finishing agent contains component (B) in an amount less than 30 wt % and have an apparent viscosity of 50-250 mPa·s at 30° C. and a surface tension of 30-45 dyn/cm.

摘要翻译： 用于热粘合的聚氨酯弹性丝的包装，其重量大于1kg，并且使得直径宽度比大于0.5并且由聚氨酯弹性丝获得，并且通过赋予其3.0-10.0重量％的整理剂 然后将其卷绕，所述整理剂是单独使用的聚丙二醇类多元醇或由作为聚丙二醇类多元醇的成分（A）或作为聚丙二醇类多元醇和 有机二异氰酸酯化合物。 整理剂含有少于30重量％的组分（B），在30℃下的表观粘度为50-250mPa.s，表面张力为30-45dyn / cm。

公开(公告)号：US10065286B2

公开(公告)日：2018-09-04

申请号：US14111888

申请日：2012-04-16

申请人： Kouki Itoyama ,  Fumio Miyazawa

发明人： Kouki Itoyama ,  Fumio Miyazawa

IPC分类号： B24B37/24 ,  B24B37/22 ,  H01L21/304 ,  C08J9/12 ,  C08G18/48 ,  C08G18/76 ,  C08G18/10 ,  C08G101/00

摘要： A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 μs, the polyurethane-polyurea resin foam has a storage elastic modulus E′ of 1 to 30 MPa, the storage elastic modulus E′ being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.

公开(公告)号：US09381612B2

公开(公告)日：2016-07-05

申请号：US14112009

申请日：2012-04-16

申请人： Kouki Itoyama ,  Fumio Miyazawa

发明人： Kouki Itoyama ,  Fumio Miyazawa

IPC分类号： C08G18/10 ,  B24B37/24 ,  C08J9/12 ,  C08G18/48 ,  C08G18/08 ,  C08G101/00

CPC分类号： B24B37/24 ,  C08G18/10 ,  C08G18/14 ,  C08G18/4854 ,  C08G2101/0008 ,  C08G2101/0083 ,  C08J9/12 ,  C08J2207/00 ,  C08J2375/04 ,  C08G18/48 ,  C08G18/3814

摘要： Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a hard segment content (HSC) in a range from 26 to 34%, and has a density D in a range from 0.30 to 0.60 g/cm3, the hard segment content (HSC) being determined by the following formula (1): HSC=100×(r−1)×(Mdi+Mda)÷(Mg+r×Mdi+(r−1)×Mda)  (1).

摘要翻译： 提供了一种抛光垫，其补救当使用常规的硬（干）抛光垫时发生划痕的问题，其抛光速率和抛光均匀性优异，并且不仅可用于初次抛光，而且可用于精抛光，以及 其制造方法。 抛光垫是用于抛光半导体器件的抛光垫，其包括具有聚氨酯 - 聚脲树脂泡沫体的抛光层，该聚氨酯 - 聚脲树脂泡沫体含有基本上为球形的电池，其中聚氨酯 - 聚脲树脂泡沫体的硬链段含量（HSC）为26〜 34％，密度D在0.30〜0.60g / cm 3的范围内，硬链段含量（HSC）由下式（1）决定：HSC = 100×（r-1）×（Mdi + Mda ）÷（Mg + r×Mdi +（r-1）×Mda）（1）。

公开(公告)号：US20140106652A1

公开(公告)日：2014-04-17

申请号：US14111962

申请日：2012-04-16

申请人： Kouki Itoyama ,  Fumio Miyazawa

发明人： Kouki Itoyama ,  Fumio Miyazawa

IPC分类号： H01L21/304 ,  B24B37/24 ,  B24B37/22

CPC分类号： H01L21/304 ,  B24B37/22 ,  B24B37/24 ,  C08G18/10 ,  C08G18/4854 ,  C08G2101/0008 ,  C08G2101/0083 ,  C08J9/12 ,  C08J2207/00 ,  C08J2375/04 ,  C08G18/3814 ,  C08G18/48

摘要： Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

摘要翻译： 提供了一种抛光垫，其补救当使用常规的硬（干）抛光垫时发生划痕的问题，其抛光速率和抛光均匀性优异，并且不仅可用于初次抛光，而且可用于精加工抛光，以及 其制造方法。 抛光垫是用于抛光半导体器件的抛光垫，其包括具有聚氨酯 - 聚脲树脂泡沫体的抛光层，其包含基本上为球形的单元，其中所述聚氨酯 - 聚脲树脂泡沫体的杨氏模量E在450至30000kPa的范围内， 密度D在0.30至0.60g / cm 3的范围内。

公开(公告)号：US20140038503A1

公开(公告)日：2014-02-06

申请号：US14111888

申请日：2012-04-16

申请人： Kouki Itoyama ,  Fumio Miyazawa

发明人： Kouki Itoyama ,  Fumio Miyazawa

IPC分类号： B24B37/24 ,  B24B37/22 ,  H01L21/304

CPC分类号： B24B37/24 ,  B24B37/22 ,  C08G18/10 ,  C08G18/4854 ,  C08G18/7621 ,  C08G2101/0008 ,  C08J9/12 ,  C08J2207/00 ,  C08J2375/04 ,  H01L21/304 ,  C08G18/3814 ,  C08G18/4829

摘要： A polishing pad for polishing a semiconductor device and manufacturing method therefor, the polishing pad comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein an M-component of the polyurethane-polyurea resin foam has a spin-spin relaxation time T2 of 160 to 260 μs, the polyurethane-polyurea resin foam has a storage elastic modulus E′ of 1 to 30 MPa, the storage elastic modulus E′ being measured at 40° C. with an initial load of 10 g, a strain range of 0.01 to 4%, and a measuring frequency of 0.2 Hz in a tensile mode, and the polyurethane-polyurea resin foam has a density D in a range from 0.30 to 0.60 g/cm3. The polishing pad remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and can be used for primary polishing or finish polishing.

摘要翻译： 一种用于抛光半导体器件的抛光垫及其制造方法，所述抛光垫包括具有聚氨酯 - 聚脲树脂泡沫的抛光层，所述聚氨酯 - 聚脲树脂泡沫体含有基本上为球形的泡孔，其中聚氨酯 - 聚脲树脂泡沫的M成分具有自旋 - 自旋松弛 时间T2为160〜260μs，聚氨酯 - 聚脲树脂发泡体的储能弹性模量E'为1〜30MPa，储能弹性模量E'在40℃下初始负荷为10g，应变 范围为0.01〜4％，拉伸模式为0.2Hz的测定频率，聚氨酯 - 聚脲树脂发泡体的密度D为0.30〜0.60g / cm 3。 抛光垫补救了当使用常规的硬（干）抛光垫时发生划痕的问题，其抛光速率和抛光均匀性极好，可用于一次抛光或精抛光。

公开(公告)号：US20140033615A1

公开(公告)日：2014-02-06

申请号：US14112009

申请日：2012-04-16

申请人： Kouki Itoyama ,  Fumio Miyazawa

发明人： Kouki Itoyama ,  Fumio Miyazawa

IPC分类号： B24B37/24

CPC分类号： B24B37/24 ,  C08G18/10 ,  C08G18/14 ,  C08G18/4854 ,  C08G2101/0008 ,  C08G2101/0083 ,  C08J9/12 ,  C08J2207/00 ,  C08J2375/04 ,  C08G18/48 ,  C08G18/3814

摘要： Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a hard segment content (HSC) in a range from 26 to 34%, and has a density D in a range from 0.30 to 0.60 g/cm3, the hard segment content (HSC) being determined by the following formula (1): HSC=100×(r−1)×(Mdi+Mda)÷(Mg+r×Mdi+(r−1)×Mda)  (1).

摘要翻译： 提供了一种抛光垫，其补救当使用常规的硬（干）抛光垫时发生划痕的问题，其抛光速率和抛光均匀性优异，并且不仅可用于初次抛光，而且可用于精加工抛光，以及 其制造方法。 抛光垫是用于抛光半导体器件的抛光垫，其包括具有聚氨酯 - 聚脲树脂泡沫体的抛光层，该聚氨酯 - 聚脲树脂泡沫体含有基本上为球形的电池，其中聚氨酯 - 聚脲树脂泡沫体的硬链段含量（HSC）为26〜 34％，密度D在0.30〜0.60g / cm 3的范围内，硬链段含量（HSC）由下式（1）决定：HSC = 100×（r-1）×（Mdi + Mda ）÷（Mg + r×Mdi +（r-1）×Mda）（1）。

公开(公告)号：US5290685A

公开(公告)日：1994-03-01

申请号：US53808

申请日：1993-04-29

申请人： Kaoru Koide ,  Takashi Fukushima ,  Tamotsu Kuwata ,  Koki Itoyama ,  Fumio Miyazawa

发明人： Kaoru Koide ,  Takashi Fukushima ,  Tamotsu Kuwata ,  Koki Itoyama ,  Fumio Miyazawa

IPC分类号： A23J3/34 ,  C07K1/18 ,  C07K14/47 ,  C12P21/00 ,  A61K37/16 ,  C07K3/12

CPC分类号： A23J3/344 ,  C07K1/18 ,  C07K14/4732

摘要： The present invention relates to a method for separating and concentrating acidic peptide, especially phosphopeptide having a phosphoserine residue, from a peptide mixture prepared by digesting casein with protease.

摘要翻译： 本发明涉及从蛋白酶消化酪蛋白制备的肽混合物中分离和浓缩酸性肽，特别是具有磷酸丝氨酸残基的磷酸肽的方法。