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    WIRING BOARD WITH BUILT-IN IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME
    1.
    发明申请
    WIRING BOARD WITH BUILT-IN IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    具有内置成像装置的接线板及其制造方法

    公开(公告)号：US20120217607A1

    公开(公告)日：2012-08-30

    申请号：US13403041

    申请日：2012-02-23

    申请人： Nobuhiro HANAI ,  Takaya Endo ,  Mitsuhiro Tomikawa

    发明人： Nobuhiro HANAI ,  Takaya Endo ,  Mitsuhiro Tomikawa

    IPC分类号： H01L31/02

    CPC分类号： H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate.

    摘要翻译： 具有内置成像元件的布线板包括具有容纳部分和第一表面的第一表面和位于第一表面的相对侧上的第二表面的基板，具有光接收器并定位在基板的容纳部分中的成像装置 使得光接收器面对基板的第一表面，以及形成在基板的第一表面上并具有绝缘层和导电层的堆积结构。 积层结构具有形成为使得成像装置的光接收器从积聚结构的开口部分露出的开口部分，并且积聚结构中的绝缘层包括形成在基板的第一表面上的第一绝缘层。

    Wiring board with built-in imaging device and method for manufacturing same
    2.
    发明授权
    Wiring board with built-in imaging device and method for manufacturing same 有权
    具有内置成像装置的接线板及其制造方法

    公开(公告)号：US08698269B2

    公开(公告)日：2014-04-15

    申请号：US13403041

    申请日：2012-02-23

    申请人： Nobuhiro Hanai ,  Takaya Endo ,  Mitsuhiro Tomikawa

    发明人： Nobuhiro Hanai ,  Takaya Endo ,  Mitsuhiro Tomikawa

    IPC分类号： H01L31/02

    CPC分类号： H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate.

    摘要翻译： 具有内置成像元件的布线板包括具有容纳部分和第一表面的第一表面和位于第一表面的相对侧上的第二表面的基板，具有光接收器并定位在基板的容纳部分中的成像装置 使得光接收器面对基板的第一表面，以及形成在基板的第一表面上并具有绝缘层和导电层的堆积结构。 积层结构具有形成为使得成像装置的光接收器从积聚结构的开口部分露出的开口部分，并且积聚结构中的绝缘层包括形成在基板的第一表面上的第一绝缘层。

    Silver halide emulsion containing two equivalent type coupler for use in photography
    5.
    发明授权
    Silver halide emulsion containing two equivalent type coupler for use in photography 失效
    含有两种用于摄影的等效型耦合器的卤化银乳剂

    公开(公告)号：US4042393A

    公开(公告)日：1977-08-16

    申请号：US615825

    申请日：1975-09-22

    申请人： Hajime Wada ,  Shouji Kikuchi ,  Haruo Hori ,  Takaya Endo

    发明人： Hajime Wada ,  Shouji Kikuchi ,  Haruo Hori ,  Takaya Endo

    IPC分类号： C07D295/185 ,  G03C7/333 ,  G03C7/34 ,  G03C7/00 ,  G03C1/40

    CPC分类号： C07D295/185 ,  G03C7/3335 ,  G03C7/34

    摘要： This invention relates to a method for developing an exposed silver halide color photosensitive material which comprises conducting the development in the presence of the following compound: ##STR1## wherein Cp is a cyan coupler residue having been removed one hydrogen atom from active methylene of the coupler; R.sub.1 and R2 are individually hydrogen, helogen, a substituted or unsubstituted group selected from an aliphatic hydrocarbon residue, an aromatic hydrocarbon residue, acyl, carbamoyl, cyans and formyl; X is a substituted or unsubstituted group selected from an aliphatic hydrocarbon residue, an aromatic hydrocarbon residue, a heterocyclic ring residue, and a carbonyl group; and n is 0 or 1 provided that, when n is 1, X is the carbonyl group.

    摘要翻译： 本发明涉及一种用于显影曝光的卤化银彩色感光材料的方法，其包括在以下化合物存在下进行显影：其中Cp是从成色剂的活性亚甲基除去一个氢原子的青色成色剂残留物 ; R1和R2分别为氢，helogen，取代或未取代的基团，选自脂族烃残基，芳族烃残基，酰基，氨基甲酰基，氰基和甲酰基; X是取代或未取代的基团，选自脂族烃残基，芳族烃残基，杂环残基和羰基; n为0或1，条件是当n为1时，X为羰基。

    Development inhibitor-releasing type compound for photographic use
    8.
    发明授权
    Development inhibitor-releasing type compound for photographic use 失效
    用于摄影用的发展抑制剂释放型化合物

    公开(公告)号：US3958993A

    公开(公告)日：1976-05-25

    申请号：US418589

    申请日：1973-11-23

    申请人： Mitsuto Fujiwhara ,  Takaya Endo ,  Ryosuke Satoh ,  Toyoaki Masukawa ,  Satoshi Nakagawa

    发明人： Mitsuto Fujiwhara ,  Takaya Endo ,  Ryosuke Satoh ,  Toyoaki Masukawa ,  Satoshi Nakagawa

    IPC分类号： G03C7/26 ,  C07D257/04 ,  C07D263/58 ,  G03C1/09 ,  G03C1/34 ,  G03C5/29 ,  G03C7/30 ,  G03C7/392 ,  G03C5/30

    CPC分类号： C07D257/04 ,  G03C1/09 ,  G03C1/346 ,  G03C7/3924 ,  Y10S430/158

    摘要： A silver photosensitive material comprising a development inhibitor-releasing compound of the formula ##EQU1## wherein Z is an atomic group necessary to form a 5 to 7 membered saturated or unsaturated carbon ring with the carbon atoms to which it is attached, said ring being unsubstituted or substituted by at least one of halogen and a member of the class consisting of alkyl, aryl, alkoxy, acyloxy, aryloxy, SY and a group forming a condensed carbon ring with said saturated or unsaturated carbon ring; Y is arylmercapto, heterocyclic, thioglycollic acid, cystein or glutathione. A method for the development of silver halide photosensitive material by the use of the foregoing compound is also disclosed.

    摘要翻译： 一种银感光材料，其包含式Z型角度C = O CH | SY的显影抑制剂释放化合物，其中Z是形成其碳原子的5至7元饱和或不饱和碳环所必需的原子团 所述环是未取代的或被卤素和由烷基，芳基，烷氧基，酰氧基，芳氧基，SY和与所述饱和或不饱和碳环形成稠合碳环的基团中的至少一个取代; Y是芳基巯基，杂环，巯基乙酸，半胱氨酸或谷胱甘肽。 还公开了通过使用上述化合物开发卤化银感光材料的方法。