摘要:
In each of oil-retaining sheets, an end edge and side edges of a recess are separated from each other. The side edges are formed into tongue portions covered by first anti-wear meshes which prevent loosing of the side edges, and these tongue portions are maintained in sliding contact with their corresponding side walls of a guide portion of a guide rail. The end edge is covered by a second anti-wear mesh which prevents loosing of the end edge, and the second anti-wear mesh is maintained in sliding contact with an end wall of the guide portion. A gap is also formed to maintain the tongue portions and the second anti-wear mesh out of contact with each other.
摘要:
A radio LSI is provided that is not to cause a delay in sending acknowledgement data. A latch circuit provided in a sending/receiving section latches frame control information out of data being received. A decoder decodes the frame control information to decode a data length and structure of an address field. Furthermore, a latch circuit latches the address-field data of the reception data according to the decoded address-field information. A comparing circuit compares a content of a register entered with an address of the opposite-of-communication completely prepared data to be sent, with a source address of the data being received, to determine a setting/resetting of frame pending in acknowledgement data. A content of the determination is sent to a data-link section. This provides information required for acknowledgement data before completely receiving data, thus eliminating the possibility to cause a delay in sending acknowledgement data.
摘要:
The object of the present invention is to provide a mold which has low reactivity with molten alloys and which is inexpensive, a method for manufacturing the same and a molded article using the mold. A mold 40 in accordance with the present invention serves for manufacturing a molded article 60 of a titanium-aluminum alloy or a titanium alloy. At least an initial layer 44a of a cavity surface 43 of a mold body 41 constituting the mold 40 is formed of a calcined product of a slurry comprising a filler having cerium oxide as a main component and a binder having silica sol as a main component.
摘要:
In a semiconductor single crystalline substrate provided with a protecting film to prevent autodoping on the reverse surface thereof, for growing a vapor-phase epitaxial layer on the main obverse surface thereof, a width of a chamfer is set for locating an edge-crown occurred in consequence of a vapor-phase epitaxial growth on the chamfer, and a gap of a distance is formed between a periphery of the protecting film and an innermost part of the chamfer on the reverse surface.
摘要:
In a semiconductor single crystalline substrate provided with a protecting film to prevent autodoping on the reverse surface thereof, for growing a vapor-phase epitaxial layer on the main obverse surface thereof, a width of a chamfer is set for locating an edge-crown occurred in consequence of a vapor-phase epitaxial growth on the chamfer, and a gap of a distance is formed between a periphery of the protecting film and an innermost part of the chamfer on the reverse surface.
摘要:
Epoxy resin compositions including an epoxy resin, a hardener and an additive for forming a rust preventing film are provided. The additive is at least one selected from dithiophosphoric acids, dithiophosphoric acid derivatives, metal salts of dithiocarbamic acids and oxidized waxes. The composition may also include a secondary additive such as an organosilicon compound, an organoaluminum compound or an organotitanium compound for dithiophosphoric acid and/or dithiophosphoric acid derivative; an alkylarylsilsesquioxane silicone compound for a metal salt of dithiocarbamic acid; an alkylarylsilsesquioxane silicone compound, an organoaluminum compound, an organotitanium compound or an organotin compound for an oxidized wax. These epoxy resin compositions, when used as encapsulating materials, prevent moisture and impurities from penetrating into the surface of an encapsulated product because of the rust preventing film existing between the composition and the encapsulated product.
摘要:
A reinforced thermoplastic resin composition comprising a thermoplastic resin, a fibrous, flaky or powdery inorganic reinforcing material, and an uncured, thermally curable resin, such as a thermosetting resin, applied to the surfaces of the inorganic reinforcing material. Molding of this composition by injection molding or the like yields a molded product in which the thermally curable resin has been cured by the heat during the molding to provide a strong chemical bond between the inorganic reinforcing material and the thermoplastic resin. The molded product thus obtained possesses more strength and/or elongation than the conventional thermoplastic resin product.
摘要:
In a communications system connected to a mobile terminal and using a network having a plurality of input/output points at a plurality of service providing servers, it is possible to maintain a TCP connection and a user session by passing a series of communication packets always taking the same route. Load balancers connected to the plurality of input/output points distribute a series of communication packets always in the same packet gateway among a plurality of packet gateways arranged between the load balancers and the service providing servers, and the packet gateway to which a packet is distributed distributes the series of communication packets to a plurality of service providing servers capable of executing an identical service.
摘要:
Epoxy resin compositions including an epoxy resin, a hardener and an additive containing a rust preventing film forming component are provided. The additive is lanolin and/or a lanolin derivative. Optionally, the composition also includes a secondary additive selected from organosilicon compounds, organoaluminum compounds, organotitantium compounds, organotin compounds, liquid rubber having functional groups at both ends of the molecule, petroleum lubricating oils or Japan wax. These epoxy resin compositions, when used as encapsulating materials, prevent moisture and impurities from invading the surface of the device.