Abstract:
Disclosed herein is a semiconductor device comprising local bit lines, a global bit line, local switch control lines, main switch control lines, hierarchical switches controlling electrical connections between the local bit lines and the global bit line in response to potentials of the local switch control lines, local switch drivers driving the local switch control lines in response to potentials of the main switch control lines, and main switch drivers selectively activating the main switch control lines.
Abstract:
A wafer-level burn-in test for a write operation to memory cells is disclosed. The memory cells are associated with a column switch transistor having a gate. In accordance with the method, a voltage level supplied for the gate is changed in correspondence with a level written into the memory cells. When a stress voltage is written into the memory cells, the gate of the column switch transistor is applied with a high level voltage, ex. a voltage higher than a normal VDD. When a zero voltage is written into the memory cells, the gate of the column switch transistor is applied with a low level voltage, ex. a zero voltage or a negative voltage.
Abstract:
When a command is input to a semiconductor memory device, a sub-threshold current is reduced to a predetermined value corresponding to the command. After the reduction of the sub-threshold current is completed, the semiconductor memory device starts to operate corresponding to the command.
Abstract:
To comprise a memory cell array, a read amplifier that is provided outside the memory cell array and amplifies data read from the memory cell array, a write amplifier that is provided outside the memory cell array and amplifies data to be written in the memory cell array, and a relief storage cell that is provided outside the memory cell array and connected to an input terminal of the read amplifier and an output terminal of the write amplifier via a switch. With this configuration, a timing of operating a main amplifier and the relief storage cell does not need to be changed depending on a position of a memory block. Further, the number of components required for connecting to the relief storage cell can be minimized.
Abstract:
A semiconductor memory device has column selecting switches in a hierarchical structure. A plurality of local column selecting switches for controlling connections between bit lines and local I/O lines. A global column selecting switch connects column selecting lines and four local column selecting switches when a bit precharging signal becomes low in level for stopping precharging the bit lines. As the column selecting switches are in a hierarchical structure including the global column selecting switch that is directly controlled by the column selecting lines and the local column selecting switches that are controlled by the global column selecting switch, a load on the column selecting lines is reduced for high-speed operation. Even when bit lines are divided into a greater number of bit lines, the number of column selecting switches that are energized by a single column selecting line is not increased, and a signal delay is prevented from occurring.
Abstract:
When a command is input to a semiconductor memory device, a sub-threshold current is reduced to a predetermined value corresponding to the command. After the reduction of the sub-threshold current is completed, the semiconductor memory device starts to operate corresponding to the command.
Abstract:
A first data amplifier connects to a first memory cell identified by an X-address signal and a selection signal obtained by predecoding a Y-address signal. A second data amplifier connects to a second memory cell identified by the X-address signal and a delayed selection signal obtained by delaying the selection signal. A generator generates a delayed operation clock signal by delaying an operation clock signal of the first data amplifier. A timing controller receives a first control signal for controlling an operation of the first data amplifier and a second control signal for controlling an operation of the second data amplifier, outputs the first control signal to the first data amplifier at a timing according to the operation clock signal, and outputs the second control signal to the second data amplifier at a timing according to the delayed operation clock signal.
Abstract:
A first data amplifier connects to a first memory cell identified by an X-address signal and a selection signal obtained by predecoding a Y-address signal. A second data amplifier connects to a second memory cell identified by the X-address signal and a delayed selection signal obtained by delaying the selection signal. A generator generates a delayed operation clock signal by delaying an operation clock signal of the first data amplifier. A timing controller receives a first control signal for controlling an operation of the first data amplifier and a second control signal for controlling an operation of the second data amplifier, outputs the first control signal to the first data amplifier at a timing according to the operation clock signal, and outputs the second control signal to the second data amplifier at a timing according to the delayed operation clock signal.
Abstract:
A semiconductor device includes a plural number of sense amplifiers that sense at least two data in parallel and that operate under a first frequency, and a multiplexer that operates under a second frequency higher than the first frequency and that sequentially serially outputs the data sensed in parallel. The semiconductor device also includes a driver circuit having a latch circuit connected to an output of the multiplexer, and an output driver circuit connected to the latch circuit and operating under the second frequency. The voltage of a power supply of the sense amplifiers is the same as the voltage of a power supply of the output driver circuit. The power supply of the sense amplifiers and the power supply of the output driver circuit are connected to respective different power supply lines.
Abstract:
To comprise a memory cell array, a read amplifier that is provided outside the memory cell array and amplifies data read from the memory cell array, a write amplifier that is provided outside the memory cell array and amplifies data to be written in the memory cell array, and a relief storage cell that is provided outside the memory cell array and connected to an input terminal of the read amplifier and an output terminal of the write amplifier via a switch. With this configuration, a timing of operating a main amplifier and the relief storage cell does not need to be changed depending on a position of a memory block. Further, the number of components required for connecting to the relief storage cell can be minimized.