SEMICONDUCTOR POLISHING COMPOUND
    2.
    发明申请

    公开(公告)号:US20080086950A1

    公开(公告)日:2008-04-17

    申请号:US11951540

    申请日:2007-12-06

    IPC分类号: B24D3/02 B24B1/00

    摘要: To provide a semiconductor polishing compound which is excellent in dispersion stability and removal rate and which has a stabilized polishing property, as it is less susceptible to an influence even when contacted with an alkaline polishing compound during its application to CMP comprising a multistage process. A polishing compound for chemical mechanical polishing to polish a surface to be polished in the production of a semiconductor circuit device, said polishing compound comprising cerium oxide abrasive particles, water and a dicarboxylic acid represented by the formula 1: HOOC(CH2)nCOOH  Formula 1 wherein n is an integer of from 1 to 4, and the pH of said polishing compound at 25° C. being within a range of from 3.5 to 6.

    摘要翻译: 提供分散稳定性和去除速度优异并且具有稳定的抛光性能的半导体抛光化合物,因为即使在与包括多级工艺在内的CMP一起使用时与碱性抛光化合物接触也不太受影响。 1.一种用于化学机械抛光的抛光化合物,用于在制造半导体电路器件时抛光待抛光的表面,所述抛光化合物包括氧化铈磨粒,水和由式1表示的二羧酸:<β在线式 描述=“在线公式”end =“lead”?> HOOC(CH 2)2 CO 2式1 <?in-line-formula description =“In- 线式“end =”tail“?>其中n是1至4的整数,并且所述抛光化合物在25℃下的pH在3.5至6的范围内。

    Semiconductor polishing compound, process for its production and polishing method
    3.
    发明申请
    Semiconductor polishing compound, process for its production and polishing method 审中-公开
    半导体抛光剂,其生产和抛光方法

    公开(公告)号:US20050126080A1

    公开(公告)日:2005-06-16

    申请号:US11039848

    申请日:2005-01-24

    CPC分类号: H01L21/31053 C09G1/02

    摘要: A semiconductor polishing compound comprising cerium oxide abrasive grains, water and an additive, wherein the additive is a water-soluble organic polymer such as ammonium polyacrylate or an anionic surfactant, the pH at 25° C. is from 3.5 to 6, and the concentration of the additive is from 0.01 to 0.5% based on the total mass of the polishing compound. This polishing compound simultaneously has dispersion stability, excellent scratch characteristics and excellent polishing planarization characteristics. In particular, this polishing compound provides excellent planarization characteristics having dishing fluctuation reduced, when used for polishing a semiconductor substrate having a silicon nitride film 3 and a silicon oxide film 2 formed on a silicon substrate 1. Further, the time for polishing a pattern wafer can be shortened by using this polishing compound.

    摘要翻译: 包含氧化铈磨粒,水和添加剂的半导体抛光化合物,其中添加剂是水溶性有机聚合物如聚丙烯酸铵或阴离子表面活性剂,25℃时的pH为3.5至6,并且浓度 的添加剂基于抛光化合物的总质量为0.01至0.5%。 该抛光化合物同时具有分散稳定性,优异的划痕特性和优异的抛光平面化特性。 特别地,当用于研磨形成在硅衬底1上的具有氮化硅膜3和氧化硅膜2的半导体衬底时,该抛光化合物提供具有凹陷波动减小的优异的平坦化特性。 此外,通过使用该研磨用化合物,可以缩短研磨图案晶片的时间。

    Head-up display, a combiner used for the head-up display and a method of
designing the head-up display
    4.
    发明授权
    Head-up display, a combiner used for the head-up display and a method of designing the head-up display 失效
    平视显示器,用于平视显示器的组合器和设置平视显示器的方法

    公开(公告)号:US5859714A

    公开(公告)日:1999-01-12

    申请号:US780218

    申请日:1997-01-08

    摘要: As a combiner, a hologram prepared by exposure to light is used wherein a combination of the central wavelength .lambda., the halfwidth .DELTA..lambda. and the diffraction efficiency .eta. of the diffraction spectrum of light minimizes the color difference between the color tone of light from a light source and the color tone in average of reflection light by the combiner, when observed by changing the angle, or the sum of the square of the color differences between the color tone of the light from the light source when observed by changing the angle and the color tone of the reflection light by the combiner. Then, the color tone of the light transmitting from the outside of a vehicle through the combiner, the light being observed by the driver of the vehicle, and the color tone of an outer light reflected by the combiner, the light being observed at the outside of the vehicle, approach a white color in comparison with use of a conventional combiner, whereby a transparent eyesight without any complementary color is given to the driver to thereby increase safety. Further, a head-up display which reduces a change of color even though an observer outside the vehicle looks at the combiner at any angular position and which gives a color tone near a white color, can be provided.

    摘要翻译: 作为组合器,使用通过曝光而制备的全息图,其中中心波长λ,半宽度DELTAλ和光衍射光谱的衍射效率eta的组合使来自光的光的色调之间的色差最小化 源和来自组合器的平均反射光的色调,当通过改变角度观察时观察到的反射光的色调,或者通过改变角度观察来自光源的光的色调之间的色差的平方和之和 组合器的反射光的色调。 然后,通过组合器从车辆的外部传输的光的色调,由车辆的驾驶员观察的光和由组合器反射的外部光的色调,在外部观察到的光 与传统的组合器的使用相比,接近白色,由此向驾驶员提供没有任何补色的透明视力,从而提高了安全性。 此外,即使在车辆外的观察者看到任何角度位置处的组合器并且给出白色附近的色调,也可以提供减少颜色变化的平视显示器。

    ABRASIVE, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    5.
    发明申请
    ABRASIVE, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
    抛光,抛光方法,制造半导体集成电路器件的方法

    公开(公告)号:US20110207327A1

    公开(公告)日:2011-08-25

    申请号:US13100338

    申请日:2011-05-04

    IPC分类号: H01L21/306 C09K13/00

    摘要: The present invention relates to a polishing method for polishing a to-be-polished surface including a polysilicon film having a silicon dioxide film directly thereunder, in manufacturing a semiconductor integrated circuit device, the method including: a first polishing step of polishing and planarizing the polysilicon film with a first abrasive containing a cerium oxide particle, water and an acid; and a second polishing step of polishing the polysilicon film planarized in the first polishing step with a second abrasive containing at least a cerium oxide particle, water, an acid and a water-soluble polyamine or a salt thereof and stopping polishing by exposure of the silicon dioxide film.

    摘要翻译: 本发明涉及在制造半导体集成电路器件时抛光包括具有二氧化硅膜的多晶硅膜的待抛光表面的抛光方法,该方法包括:第一抛光步骤,用于抛光和平坦化 具有含有氧化铈颗粒的第一研磨剂,水和酸的多晶硅膜; 以及第二抛光步骤,用在第一研磨步骤中平坦化的多晶硅膜用至少含有二氧化铈颗粒,水,酸和水溶性多胺或其盐的第二研磨剂进行抛光,并通过暴露硅来停止抛光 二氧化物薄膜。

    Polishing compound, method for production thereof, and polishing method
    6.
    发明授权
    Polishing compound, method for production thereof, and polishing method 有权
    抛光剂,其制造方法和研磨方法

    公开(公告)号:US07854777B2

    公开(公告)日:2010-12-21

    申请号:US10831618

    申请日:2004-04-26

    CPC分类号: H01L21/3212 C09G1/02

    摘要: A heterocyclic benzene compound such as benzotriazole, is dissolved in at least one substance selected from the group consisting of a primary alcohol having from 1 to 4 carbon atoms, a glycol having from 2 to 4 carbon atoms, an ether represented by the Formula 2 (wherein m is an integer of from 1 to 4), N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethyl sulfoxide, γ-butyrolactone and propylene carbonate, and an aqueous dispersion of fine oxide particles which constitute abrasive grains is mixed therewith, whereby a polishing compound is obtained. By use of this polishing compound in polishing a substrate provided with an insulating film 2 on which a wiring metal film 4 and a barrier film 3 are formed, the formation of an embedded wiring 5 is made possible with low dishing, low erosion and low scratching at a high removal rate.

    摘要翻译: 将杂环苯化合物如苯并三唑溶解在至少一种选自具有1至4个碳原子的伯醇,具有2至4个碳原子的二醇,由式2表示的醚( 其中m为1〜4的整数),N-甲基-2-吡咯烷酮,N,N-二甲基甲酰胺,二甲基亚砜,γ-丁内酯,碳酸亚丙酯,以及构成磨粒的氧化物微粒的水性分散体混合 从而获得抛光化合物。 通过使用该研磨用化合物研磨配置有布线金属膜4和阻挡膜3的绝缘膜2的基板,能够以低凹陷,低侵蚀和低刮擦形成嵌入布线5 以高的去除率。

    SEMICONDUCTOR POLISHING COMPOUND, PROCESS FOR ITS PRODUCTION AND POLISHING METHOD
    7.
    发明申请
    SEMICONDUCTOR POLISHING COMPOUND, PROCESS FOR ITS PRODUCTION AND POLISHING METHOD 审中-公开
    半导体抛光化合物,其生产方法及抛光方法

    公开(公告)号:US20100055909A1

    公开(公告)日:2010-03-04

    申请号:US12618018

    申请日:2009-11-13

    IPC分类号: H01L21/306 C09K13/00

    CPC分类号: H01L21/31053 C09G1/02

    摘要: A semiconductor polishing compound comprising cerium oxide abrasive grains, water and an additive, wherein the additive is a water-soluble organic polymer such as ammonium polyacrylate or an anionic surfactant, the pH at 25° C. is from 3.5 to 6, and the concentration of the additive is from 0.01 to 0.5% based on the total mass of the polishing compound. This polishing compound simultaneously has dispersion stability, excellent scratch characteristics and excellent polishing planarization characteristics. In particular, this polishing compound provides excellent planarization characteristics having dishing fluctuation reduced, when used for polishing a semiconductor substrate having a silicon nitride film 3 and a silicon oxide film 2 formed on a silicon substrate 1. Further, the time for polishing a pattern wafer can be shortened by using this polishing compound.

    摘要翻译: 包含氧化铈磨粒,水和添加剂的半导体抛光化合物,其中添加剂是水溶性有机聚合物如聚丙烯酸铵或阴离子表面活性剂,25℃时的pH为3.5至6,并且浓度 的添加剂基于抛光化合物的总质量为0.01至0.5%。 该抛光化合物同时具有分散稳定性,优异的划痕特性和优异的抛光平面化特性。 特别地,当用于抛光形成在硅衬底1上的具有氮化硅膜3和氧化硅膜2的半导体衬底时,该抛光化合物提供具有凹陷波动减小的优异的平坦化特性。此外,用于研磨图案晶片的时间 可以通过使用这种抛光化合物来缩短。

    Holographic display device and method for producing a transmission diffusion hologram suitable for it
    8.
    发明授权

    公开(公告)号:US06545778B2

    公开(公告)日:2003-04-08

    申请号:US09976161

    申请日:2001-10-15

    IPC分类号: G03H100

    摘要: A holographic display device, e.g. for a vehicle, which reduces a color of hologram reflection toward the outside of the vehicle or a color of hologram transmission toward the inside of the vehicle generated at a hologram installation portion of a wind-proof glass, and which further reduces an external light noise. Light from a display element is transmitted through an imaging optical component to form a display image on a transmission diffusion hologram provided to a wind-proof glass, and the display image is reflected on the surface on the vehicle outer side of the wind-proof glass for visual recognition by an observer. The above transmission diffusion hologram is produced by diffused light, which is transmitted through a diffusion optical component, being made to fall on one side of a hologram photosensitive material.

    摘要翻译: 全息显示装置,例如 对于在防风玻璃的全息图安装部分产生的朝向车辆外部的全息图反射的颜色或全息图传输的颜色朝向车辆内部产生的,从而进一步减少外部光噪声 。 通过成像光学部件透射来自显示元件的光,以在设置在防风玻璃上的透射扩散全息图上形成显示图像,并且显示图像在防风玻璃的车辆外侧的表面上反射 用于观察者的视觉识别。 上述透射扩散全息图是通过漫射光学部件传播的扩散光产生的,使其落在全息图感光材料的一侧。