公开(公告)号：US20090102891A1

公开(公告)日：2009-04-23

申请号：US12254549

申请日：2008-10-20

申请人： Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Noriyoshi SHOJI ,  Yoshinori SATO ,  Norimitsu SANBONGI

发明人： Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Noriyoshi SHOJI ,  Yoshinori SATO ,  Norimitsu SANBONGI

IPC分类号： B41J2/05 ,  B23P11/00

CPC分类号： H05B3/16 ,  B41J2/3357 ,  B41J2/33585 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/49826

摘要： Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 μm or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.

摘要翻译： 提供一种加热电阻元件（1），包括：绝缘基板（9）; 与绝缘基板（9）的表面接合的蓄热层（10）; 以及设置在所述蓄热层（10）上的加热电阻（11），其中：在所述绝缘基板（9）和所述蓄热层（10）之间的至少一个接合面（9a）上，至少一个 所述绝缘基板（9）和所述蓄热层（10）在与所述加热电阻体（11）相对的区域设置有凹部（16），形成中空部（17）。 并且所述中空部分（17）包括在所述绝缘基板（9）的一侧上的内表面，所述内表面被加工成具有0.2μm或更大的表面粗糙度（Ra）。 因此，可以抑制中空部（17）的气体中的积聚，提高打印质量。

公开(公告)号：US20120144659A1

公开(公告)日：2012-06-14

申请号：US13397900

申请日：2012-02-16

申请人： Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Noriyoshi SHOJI ,  Yoshinori SATO ,  Norimitsu SANBONGI

发明人： Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Noriyoshi SHOJI ,  Yoshinori SATO ,  Norimitsu SANBONGI

IPC分类号： H01C17/00

CPC分类号： H05B3/16 ,  B41J2/3357 ,  B41J2/33585 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/49826

摘要： A manufacturing method for a heating resistor element includes a concave portion forming step, a bonding step and a resistor forming step. The concave portion forming step includes forming a concave portion on at least one of bonded surfaces between an insulating substrate and a heat accumulating layer. The bonding step causes the bonded surfaces between the insulating substrate and the heat accumulating layer to adhere to each other to bond the insulating substrate and the heat accumulating layer. The resistor forming step includes forming a heating resistor at a position on the heat accumulating layer. The position is opposed to the concave portion. The concave portion forming step further includes processing an inner surface of the concave portion on a side of the insulating substrate to have surface roughness Ra of 0.2 μm or more.

摘要翻译： 一种加热电阻元件的制造方法包括凹部形成步骤，接合步骤和电阻器形成步骤。 凹部形成工序包括在绝缘基板和蓄热层的至少一个接合面上形成凹部。 接合步骤使得绝缘基板和蓄热层之间的接合表面彼此粘附以将绝缘基板和蓄热层结合。 电阻器形成步骤包括在蓄热层的位置形成发热电阻体。 位置与凹部相对。 所述凹部形成工序还包括对所述绝缘基板侧的所述凹部的内表面进行处理，使表面粗糙度Ra为0.2μm以上。

公开(公告)号：US20120224015A1

公开(公告)日：2012-09-06

申请号：US13409230

申请日：2012-03-01

申请人： Norimitsu SANBONGI ,  Noriyoshi SHOJI ,  Toshimitsu MOROOKA ,  Keitaro KOROISHI

发明人： Norimitsu SANBONGI ,  Noriyoshi SHOJI ,  Toshimitsu MOROOKA ,  Keitaro KOROISHI

IPC分类号： B41J2/335 ,  B05D5/00 ,  B05D5/12

CPC分类号： B41J2/3357 ,  B41J2/3354 ,  B41J2/3359

摘要： Adopted is a thermal head, including: a heating resistor provided on a support substrate; a pair of electrode formed on the heating resistor so as to be spaced apart in a direction along a surface of the heating resistor, the pair of electrodes respectively having inclined surfaces which are spaced apart from each other as a distance from the support substrate increases; a burying film for burying a region between the pair of electrodes; and a protective film formed on the region buried by the burying film and on the pair of electrodes.

摘要翻译： 采用热敏头，包括：设在支撑基板上的加热电阻; 一对电极形成在加热电阻器上以沿着加热电阻器的表面的方向间隔开，所述一对电极分别具有与支撑衬底相距一定距离的倾斜表面; 用于掩埋该对电极之间的区域的掩埋膜; 以及形成在被掩埋膜和一对电极上埋设的区域上的保护膜。

公开(公告)号：US20120212557A1

公开(公告)日：2012-08-23

申请号：US13401891

申请日：2012-02-22

申请人： Toshimitsu MOROOKA ,  Keitaro Karoishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

发明人： Toshimitsu MOROOKA ,  Keitaro Karoishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC分类号： B41J2/335 ,  H01C17/00

CPC分类号： B41J2/335 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3357 ,  B41J2/33585

摘要： Adopted is a thermal head, including: a support substrate including a concave portion formed in a front surface thereof; an upper substrate, which is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed at a position corresponding to the concave portion; a heating resistor provided on a front surface of the upper substrate at a position straddling the convex portion; and a pair of electrodes provided on both sides of the heating resistor, in which at least one of the pair of electrodes include: a thin portion, which is connected to the heating resistor at a distal end surface of the convex portion in a region corresponding to the concave portion; and a thick portion, which is connected to the heating resistor and is formed thicker than the thin portion.

摘要翻译： 采用热敏头，包括：支撑基板，其包括形成在其前表面中的凹部; 上层基板，其以叠层状态接合到所述支撑基板的前表面，并且包括形成在与所述凹部对应的位置的凸部; 加热电阻器，其设置在跨越所述凸部的位置的所述上基板的前表面上; 以及一对电极，其设置在所述加热电阻器的两侧，所述一对电极中的至少一个包括：薄部，其在对应于所述凸起部的区域的所述凸部的远端表面处连接到所述加热电阻器 到凹部; 以及连接到加热电阻器并且形成为比薄部分厚的厚部分。