REFERENCE-IMAGE CONFIRMATION METHOD, MASK INSPECTION METHOD, AND MASK INSPECTION DEVICE

    公开(公告)号:US20180101941A1

    公开(公告)日:2018-04-12

    申请号:US15723948

    申请日:2017-10-03

    摘要: To include generating a reference image based on a comparison between design data of a mask having patterns and an optical image of the mask in a first region of the mask designated in advance, and confirming whether the generated reference image has effectiveness, the generating and the confirming being performed by a reference circuit, in which the confirmation on whether the reference image has effectiveness includes adding, as a confirmation region in which whether the reference image has effectiveness is to be confirmed, a second region of the mask in addition to the first region set in advance as the confirmation region, the adding being performed by an addition circuit, and confirming whether the reference image has effectiveness in the confirmation region including the first region and the second region, the confirming being performed by the reference circuit.

    INSPECTION METHOD
    3.
    发明申请
    INSPECTION METHOD 有权
    检查方法

    公开(公告)号:US20150279024A1

    公开(公告)日:2015-10-01

    申请号:US14208757

    申请日:2014-03-13

    IPC分类号: G06T7/00 G06K9/62

    摘要: An inspection method comprising, virtually dividing a sample, in which a plurality of chip patterns are formed, into a plurality of strip-shaped stripes along a predetermined direction to acquire an optical image of the chip pattern in each of the stripes, performing filtering based on design data of the chip pattern to produce a reference image corresponding to the optical image, comparing the chip pattern using a die-to-database method and comparing a repetitive pattern portion in the chip pattern using a cell method, obtaining at least one of a dimension difference and a dimension ratio between a pattern of the optical image and a pattern of the reference image compared to the pattern of the optical image by the die-to-database method; and obtaining a dimension distribution of the plurality of chip patterns from at least one of the dimension difference and the dimension ratio.

    摘要翻译: 一种检查方法,其特征在于,沿着规定的方向,将形成有多个芯片图案的样品实际上分割为多个条状条,从而获得每个条纹中的芯片图案的光学图像, 对所述芯片图案的设计数据进行编码以产生与所述光学图像相对应的参考图像,使用芯片到数据库方法比较所述芯片图案,并使用单元方法比较所述芯片图案中的重复图案部分,获得至少一个 通过模 - 数据库方法与光学图像的图案相比,光学图像的图案和参考图像的图案之间的尺寸差和尺寸比; 以及从所述尺寸差和尺寸比中的至少一个获得所述多个芯片图案的尺寸分布。