公开(公告)号：US20180319108A1

公开(公告)日：2018-11-08

申请号：US16002025

申请日：2018-06-07

Applicant: Nuvotronics, Inc.

Inventor： David W. Sherrer ,  Dara L. Cardwell

IPC: B29C70/88 ,  B29C64/106 ,  B22D19/00 ,  C25D5/02 ,  B29C64/00 ,  H05K3/46 ,  H05K3/12

CPC classification number: B29C70/882 ,  B22D19/00 ,  B29C64/00 ,  B29C64/106 ,  C25D5/02 ,  H05K3/1275 ,  H05K3/4664 ,  H05K2201/0191 ,  H05K2201/0195

Abstract: The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.