Abstract:
A method of forming a nozzle of a fluid ejection device, the nozzle having a straight mouth portion and a cavity portion, wherein the mouth portion is formed in a bottom surface of the substrate, and, after passivating the walls of the mouth portion, a wet etch process is applied from the bottom surface of the substrate for forming a part of the cavity portion with walls that diverge from the mouth portion, characterized in that a wet etch process is also applied from a top surface of the substrate for forming a part of the cavity portion which diverges towards the bottom surface and merges with the part that is etched from the bottom surface.
Abstract:
A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.
Abstract:
A method for manufacturing a nozzle and an associated funnel in a single plate comprises providing the single plate, the plate being etchable; providing an etch resistant mask on the plate, the mask having a pattern, wherein the pattern comprises a first pattern part for etching the nozzle and a second pattern part for etching the funnel; covering one of the first pattern part and the second pattern part using a first cover; etching one of the nozzle and funnel corresponding to the pattern part not covered in step (c); removing the first cover; etching the other one of the nozzle and funnel; and removing the etch resistant mask.