公开(公告)号：US11869823B2

公开(公告)日：2024-01-09

申请号：US17091371

申请日：2020-11-06

申请人： Octavo Systems LLC

发明人： Michael Kenneth Conti ,  Christopher Lloyd Reinert ,  Masood Murtuza

IPC分类号： H01L23/495 ,  H01L23/32 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/32 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227

摘要： Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.

公开(公告)号：US11257803B2

公开(公告)日：2022-02-22

申请号：US16549841

申请日：2019-08-23

申请人： OCTAVO SYSTEMS LLC

发明人： Masood Murtuza ,  Erik James Welsh ,  Christopher Lloyd Reinert ,  Gene Alan Frantz

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

摘要： A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.

公开(公告)号：US20200066702A1

公开(公告)日：2020-02-27

申请号：US16549841

申请日：2019-08-23

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Erik James Welsh ,  Christopher Lloyd Reinert ,  Gene Alan FRANTZ

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

摘要： Methods and structures for manufacturing one or more System in a Package (SiP) devices. The functionality of a packaged SiP device can be modified according to aspects of the disclosure.