公开(公告)号：US20200243451A1

公开(公告)日：2020-07-30

申请号：US16755376

申请日：2018-10-11

申请人： Octavo Systems LLC

发明人： Gene Alan FRANTZ ,  Masood MURTUZA ,  Erik James WELSH ,  Peter Robert LINDER

IPC分类号： H01L23/538 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  G11C5/04

摘要： High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

公开(公告)号：US20190206779A1

公开(公告)日：2019-07-04

申请号：US16330007

申请日：2017-08-31

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Erik James WELSH ,  Peter LINDER ,  Gene Alan FRANTZ

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18

CPC分类号： H01L23/49833 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/49513 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/14511 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/111 ,  H05K1/181

摘要： A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.

公开(公告)号：US20220028704A1

公开(公告)日：2022-01-27

申请号：US17414237

申请日：2019-12-18

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Gene Alan FRANTZ

IPC分类号： H01L21/56 ,  H01L23/13 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  G06F30/20

摘要： Packaged devices are provided for use inside an electronic system that provides access for molding compound or cables by using groove-like features on the bottom of a device package or on top of a substrate, and methods regarding the same. The groove-like features prevent voids in the encapsulant before and after packaging of the electronic system.

公开(公告)号：US20200066702A1

公开(公告)日：2020-02-27

申请号：US16549841

申请日：2019-08-23

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Erik James Welsh ,  Christopher Lloyd Reinert ,  Gene Alan FRANTZ

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

摘要： Methods and structures for manufacturing one or more System in a Package (SiP) devices. The functionality of a packaged SiP device can be modified according to aspects of the disclosure.

公开(公告)号：US20190273073A1

公开(公告)日：2019-09-05

申请号：US16293130

申请日：2019-03-05

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Gene Alan FRANTZ

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  G06F17/50 ,  G01R31/28

摘要： The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.

公开(公告)号：US20190115331A1

公开(公告)日：2019-04-18

申请号：US16218215

申请日：2018-12-12

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Gene Alan FRANTZ

IPC分类号： H01L25/16 ,  H01L23/538 ,  H01L23/00 ,  H01L23/495 ,  H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H01L25/00 ,  H01L23/498

摘要： Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.

公开(公告)号：US20190074268A1

公开(公告)日：2019-03-07

申请号：US15757042

申请日：2016-09-02

申请人： Octavo Systems LLC

发明人： Masood MURTUZA ,  Gene Alan FRANTZ ,  Neeraj Kumar Reddy DANTU

IPC分类号： H01L25/10 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16 ,  H01L23/31 ,  H01L23/367

摘要： Methods, systems, and devices for enabling the use of SIP subsystems to make a configurable system with desired characteristics and features are provided. A configurable system's unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems.

公开(公告)号：US20210072958A1

公开(公告)日：2021-03-11

申请号：US16975013

申请日：2019-02-22

申请人： Octavo Systems LLC

发明人： Erik James WELSH ,  Laurence Ray SIMAR, Jr. ,  Peter LINDER ,  Gene Alan FRANTZ

IPC分类号： G06F7/57 ,  G06F7/485 ,  G06F7/499 ,  H03M1/12 ,  H03M1/66

摘要： The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.

公开(公告)号：US20200303321A1

公开(公告)日：2020-09-24

申请号：US16898023

申请日：2020-06-10

申请人： Octavo Systems LLC

发明人： Masood MURTUZA ,  Peter Robert Linder ,  Gene Alan FRANTZ

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/16

摘要： Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.