公开(公告)号：US11347478B2

公开(公告)日：2022-05-31

申请号：US16975013

申请日：2019-02-22

申请人： Octavo Systems LLC

发明人： Erik James Welsh ,  Laurence Ray Simar, Jr. ,  Peter Linder ,  Gene Alan Frantz

IPC分类号： G06F7/57 ,  G06F7/485 ,  G06F7/499 ,  G06J1/00

摘要： The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.

公开(公告)号：US11032910B2

公开(公告)日：2021-06-08

申请号：US15968184

申请日：2018-05-01

申请人： Octavo Systems LLC

发明人： Erik James Welsh ,  Kevin Michael Troy

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  H05K1/02 ,  H05K1/11 ,  H01L25/18

摘要： Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.

公开(公告)号：US20180317323A1

公开(公告)日：2018-11-01

申请号：US15968184

申请日：2018-05-01

申请人： Octavo Systems LLC

发明人： Erik James Welsh ,  Kevin Michael Troy

IPC分类号： H05K1/18 ,  H05K3/00 ,  H05K1/02 ,  H05K1/11

摘要： Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.

公开(公告)号：US11610844B2

公开(公告)日：2023-03-21

申请号：US16755376

申请日：2018-10-11

申请人： Octavo Systems LLC

发明人： Gene Alan Frantz ,  Masood Murtuza ,  Erik James Welsh ,  Peter Robert Linder

IPC分类号： H01L23/52 ,  H01L23/538 ,  G11C5/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065

摘要： High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

公开(公告)号：US11257803B2

公开(公告)日：2022-02-22

申请号：US16549841

申请日：2019-08-23

申请人： OCTAVO SYSTEMS LLC

发明人： Masood Murtuza ,  Erik James Welsh ,  Christopher Lloyd Reinert ,  Gene Alan Frantz

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

摘要： A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.

公开(公告)号：US20200066702A1

公开(公告)日：2020-02-27

申请号：US16549841

申请日：2019-08-23

申请人： OCTAVO SYSTEMS LLC

发明人： Masood MURTUZA ,  Erik James Welsh ,  Christopher Lloyd Reinert ,  Gene Alan FRANTZ

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

摘要： Methods and structures for manufacturing one or more System in a Package (SiP) devices. The functionality of a packaged SiP device can be modified according to aspects of the disclosure.

公开(公告)号：US12001363B2

公开(公告)日：2024-06-04

申请号：US17926438

申请日：2021-05-21

申请人： Octavo Systems LLC

发明人： Peter Robert Linder ,  Masood Murtuza ,  Erik James Welsh ,  William Arthur Fitzhugh Lee

IPC分类号： G06F13/36 ,  G06F15/78

CPC分类号： G06F13/36 ,  G06F15/7807

摘要： A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.

公开(公告)号：US11502030B2

公开(公告)日：2022-11-15

申请号：US16330007

申请日：2017-08-31

申请人： OCTAVO SYSTEMS LLC

发明人： Masood Murtuza ,  Erik James Welsh ,  Peter Linder ,  Gene Alan Frantz

IPC分类号： H05K1/11 ,  H01L23/498 ,  H01L25/16 ,  H01L23/538 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/00 ,  H05K1/18 ,  H01L25/065

摘要： A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.

公开(公告)号：US10470294B2

公开(公告)日：2019-11-05

申请号：US15968171

申请日：2018-05-01

申请人： Octavo Systems LLC

发明人： Erik James Welsh ,  Peter Linder

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  G06F17/50 ,  H01L25/16 ,  H05K1/18

摘要： Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.

公开(公告)号：US20180317316A1

公开(公告)日：2018-11-01

申请号：US15968171

申请日：2018-05-01

申请人： Octavo Systems LLC

发明人： Erik James Welsh ,  Peter Linder

IPC分类号： H05K1/02 ,  G06F17/50 ,  H01L25/16 ,  H05K1/18

CPC分类号： H05K1/0231 ,  G06F17/5063 ,  G06F17/5072 ,  H01L25/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10522

摘要： Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.