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公开(公告)号：US11171126B2
公开(公告)日：2021-11-09
申请号：US15757042
申请日：2016-09-02
申请人： Octavo Systems LLC
IPC分类号： H01L25/10 , H01L21/50 , H05K1/02 , H01L23/31 , H01L23/367 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/16 , H01L25/00 , H05K1/14 , H05K3/34 , H01L23/36 , H03F3/45
摘要： Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.
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公开(公告)号：US11869823B2
公开(公告)日：2024-01-09
申请号：US17091371
申请日：2020-11-06
申请人： Octavo Systems LLC
IPC分类号： H01L23/495 , H01L23/32 , H01L23/00 , H01L23/31 , H01L23/498 , H01L21/48 , H01L21/56
CPC分类号： H01L23/32 , H01L21/4853 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L24/48 , H01L2224/16227 , H01L2224/48227
摘要： Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.
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公开(公告)号：US11610844B2
公开(公告)日：2023-03-21
申请号：US16755376
申请日：2018-10-11
申请人： Octavo Systems LLC
IPC分类号： H01L23/52 , H01L23/538 , G11C5/04 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/065
摘要： High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.
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公开(公告)号：US11257803B2
公开(公告)日：2022-02-22
申请号：US16549841
申请日：2019-08-23
申请人： OCTAVO SYSTEMS LLC
摘要： A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.
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公开(公告)号：US12001363B2
公开(公告)日：2024-06-04
申请号：US17926438
申请日：2021-05-21
申请人： Octavo Systems LLC
CPC分类号： G06F13/36 , G06F15/7807
摘要： A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.
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公开(公告)号：US11502030B2
公开(公告)日：2022-11-15
申请号：US16330007
申请日：2017-08-31
申请人： OCTAVO SYSTEMS LLC
IPC分类号： H05K1/11 , H01L23/498 , H01L25/16 , H01L23/538 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/00 , H05K1/18 , H01L25/065
摘要： A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.
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公开(公告)号：US11302648B2
公开(公告)日：2022-04-12
申请号：US16898023
申请日：2020-06-10
申请人： Octavo Systems LLC
IPC分类号： H01L23/552 , H01L23/00 , H01L21/56 , H01L23/16 , H01L23/498 , H01L23/31
摘要： Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.
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公开(公告)号：US11157676B2
公开(公告)日：2021-10-26
申请号：US16335204
申请日：2017-09-18
申请人： OCTAVO SYSTEMS LLC
IPC分类号： G06F30/394 , G06F30/327 , G06F30/367 , G06F30/392 , G06F30/398 , G06F113/20 , G06F115/10 , G06F119/06
摘要： Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.
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公开(公告)号：US11211369B2
公开(公告)日：2021-12-28
申请号：US16293130
申请日：2019-03-05
申请人： OCTAVO SYSTEMS LLC
发明人： Masood Murtuza , Gene Alan Frantz
IPC分类号： H01L25/16 , H01L23/498 , H01L23/538 , H01L23/31 , G01R31/28 , H01L25/00 , G06F30/34
摘要： The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.
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公开(公告)号：US10714430B2
公开(公告)日：2020-07-14
申请号：US16041357
申请日：2018-07-20
申请人： Octavo Systems LLC
IPC分类号： H01L23/552 , H01L21/56 , H01L23/00 , H01L23/16 , H01L23/498 , H01L23/31
摘要： Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.
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