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公开(公告)号：US20190385088A1
公开(公告)日：2019-12-19
申请号：US16012543
申请日：2018-06-19
IPC分类号： G06N99/00 , H04B10/70 , H04Q3/52 , H04L12/933 , G01R33/035
摘要： Real-time reconfigurability of quantum object connectivity can be provided with one or more quantum routers that can each be configured as either or both of a single-pole double-throw switch and a cross-point switch. The quantum router includes variable-inductance coupling elements in RF-SQUIDs having inductors transformer-coupled to two control flux lines, one providing a static current and the other providing a dynamic current, the direction of which can be toggled to couple or uncouple quantum objects, such as qubits, based on the dynamic current direction to provide reconfigurable quantum routing.
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公开(公告)号：US20180336153A1
公开(公告)日：2018-11-22
申请号：US16026573
申请日：2018-07-03
CPC分类号： G06F13/4027 , G06F13/4068 , G06N10/00 , H01L39/025 , H01L39/223
摘要： A tunable bus-mediated coupling system is provided that includes a first input port coupled to a first end of a variable inductance coupling element through a first resonator and a second input port coupled to a second end of the variable inductance coupling element through a second resonator. The first input port is configured to be coupled to a first qubit, and the second output port is configured to be coupled to a second qubit. A controller is configured to control the inductance of the variable inductance coupling element between a low inductance state to provide strong coupling between the first qubit and the second qubit and a high inductance state to provide isolation between the first qubit and the second qubit.
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公开(公告)号：US20200220064A1
公开(公告)日：2020-07-09
申请号：US16241661
申请日：2019-01-07
申请人： AURELIUS L. GRANINGER , JOEL D. STRAND , MICAH JOHN ATMAN STOUTIMORE , ZACHARY KYLE KEANE , JEFFREY DAVID HARTMAN , JUSTIN C. HACKLEY
发明人： AURELIUS L. GRANINGER , JOEL D. STRAND , MICAH JOHN ATMAN STOUTIMORE , ZACHARY KYLE KEANE , JEFFREY DAVID HARTMAN , JUSTIN C. HACKLEY
摘要： Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.
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公开(公告)号：US20210257532A1
公开(公告)日：2021-08-19
申请号：US17168443
申请日：2021-02-05
申请人： AURELIUS L. GRANINGER , JOEL D. STRAND , MICAH JOHN ATMAN STOUTIMORE , ZACHARY KYLE KEANE , JEFFREY DAVID HARTMAN , JUSTIN C. HACKLEY
发明人： AURELIUS L. GRANINGER , JOEL D. STRAND , MICAH JOHN ATMAN STOUTIMORE , ZACHARY KYLE KEANE , JEFFREY DAVID HARTMAN , JUSTIN C. HACKLEY
IPC分类号： H01L39/02 , G01R31/28 , H01L21/66 , H01L23/00 , H01L25/065 , H01L27/18 , H01L39/08 , H01L39/10 , H01L39/12 , H01L39/06 , H01L39/22
摘要： Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.
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